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21 - 30 of 4,294 results
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82P2521BHG
Renesas Electronics Corporation
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$103.7933 | Yes | Yes | Active | 1.8 V | PCM JITTER ATTENUATOR | 1 | INDUSTRIAL | S-PBGA-B640 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 640 | PLASTIC/EPOXY | BGA | BGA640,30X30,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 31 mm | 31 mm | 2.44 mm | RENESAS ELECTRONICS CORP | PBGA | 640 | BHG640 | compliant | NLR | 8542390001 | Renesas Electronics | |||||||||||
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ZL50232QCG1
Microchip Technology Inc
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$135.5129 | Yes | Active | 1.8 V | ISDN ECHO CANCELLER | 1 | 250 µA | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | compliant | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 | ||||||||||||||||||
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ZL50232GDG2
Microchip Technology Inc
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$135.5129 | Yes | Active | 1.8 V | ISDN ECHO CANCELLER | 1 | 250 µA | INDUSTRIAL | S-PBGA-B208 | e1 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | LBGA | BGA208,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.5 mm | MICROCHIP TECHNOLOGY INC | compliant | 17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, MO-192, LBGA-208 | ||||||||||||||||||
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M28352
Synaptics Incorporated
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Check for Price | No | Active | INDUSTRIAL | S-PBGA-B280 | e0 | Not Qualified | 85 °C | -40 °C | 280 | PLASTIC/EPOXY | BGA | BGA280,18X18,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | SYNAPTICS INC | compliant | 8542.39.00.01 | BGA, BGA280,18X18,40 | ||||||||||||||||||||||||
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DS3254A3+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | PCM TRANSCEIVER | 1 | COMMERCIAL | S-PBGA-B144 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 13 mm | 13 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | 13 X 13 MM, 1 MM PITCH, CSBGA-144 | ||||||||||||||||||||
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ZL38065GDG
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 1.8 V | ISDN ECHO CANCELLER | 1 | INDUSTRIAL | S-PBGA-B208 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 208 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.5 mm | ZARLINK SEMICONDUCTOR INC | compliant | 8542.39.00.01 | 17 X 17 MM, 1.30 MM HEIGHT, MO-192, LBGA-208 | |||||||||||||||||
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LXT322PE
Cortina Systems Inc
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Check for Price | Transferred | 5 V | CMOS | T-1(DS1) | 1.544 Gbps | PCM TRANSCEIVER | 1 | INDUSTRIAL | S-PQCC-J44 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.572 mm | CORTINA SYSTEMS INC | LCC | 44 | compliant | 8542.39.00.01 | QCCJ, LDCC44,.7SQ | ||||||||||||||||
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ZN5683E
Microsemi Corporation
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Check for Price | Obsolete | 5 V | PCM TRANSCEIVER | 1 | INDUSTRIAL | R-PDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | ZARLINK SEMICONDUCTOR INC | DIP | 18 | unknown | 8542.39.00.01 | DIP, | ||||||||||||||||||||||
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PEB2080
Infineon Technologies AG
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Check for Price | No | Obsolete | 5 V | CMOS | 144 Mbps | BASIC | S/T | COMMERCIAL | R-PDIP-T22 | e0 | Not Qualified | CCITT I.430 | 70 °C | 22 | PLASTIC/EPOXY | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INFINEON TECHNOLOGIES AG | not_compliant | 8542.39.00.01 | ||||||||||||||||||||
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EELXT351PEA2
Intel Corporation
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Check for Price | Transferred | 5 V | PCM TRANSCEIVER | 1 | INDUSTRIAL | S-PQCC-J28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | INTEL CORP | QLCC | 28 | unknown | 8542.39.00.01 | QCCJ, |