Parametric results for: FR+1514-M2 under Digital Transmission Controllers

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CN8330EPJD
Conexant Systems Inc
Check for Price No Obsolete 5 V CMOS FRAMER 1 175 µA INDUSTRIAL S-PQCC-J68 e0 Not Qualified 85 °C -40 °C 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 5.08 mm CONEXANT SYSTEMS LCC QCCJ, LDCC68,1.0SQ 68 unknown 8542.39.00.01
TP3155V/NOPB
Texas Instruments
Check for Price Yes Obsolete 5 V CMOS TIME SLOT ASSIGNER 1 1.5 mA COMMERCIAL S-PQCC-J20 e3 Not Qualified 3 70 °C 260 40 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 8.89 mm 8.89 mm 4.57 mm NATIONAL SEMICONDUCTOR CORP QCCJ, LDCC20,.4SQ compliant 8542.39.00.01
DS2154LA2+
Maxim Integrated Products
Check for Price Yes Yes Obsolete 5 V CMOS FRAMER 1 COMMERCIAL S-PQFP-G100 e3 Not Qualified 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm MAXIM INTEGRATED PRODUCTS INC QFP LFQFP, 100 compliant 8542.39.00.01
BT8376EPF
Mindspeed Technologies Inc
Check for Price No No Obsolete 5 V CMOS FRAMER 1 175 mA INDUSTRIAL S-PQFP-G80 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 80 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 14 mm 14 mm 2.3 mm MINDSPEED TECHNOLOGIES INC QFP QFP, 80 compliant 8542.39.00.01
T8105---BAL3-BB
LSI Corporation
Check for Price No No Transferred 3.3 V CMOS TIME SLOT ASSIGNER 1 275 µA INDUSTRIAL S-PBGA-B217 e0 Not Qualified 85 °C -40 °C 217 PLASTIC/EPOXY BGA BGA217,17X17,50 SQUARE GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 23 mm 23 mm 2.32 mm AGERE SYSTEMS INC BGA BGA, BGA217,17X17,50 217 unknown 8542.39.00.01
TTSI2K32T
LSI Corporation
Check for Price No Transferred 3.3 V CMOS TIME SLOT ASSIGNER 1 INDUSTRIAL X-PBGA-X217 Not Qualified 85 °C -40 °C 217 PLASTIC/EPOXY BGA UNSPECIFIED GRID ARRAY YES UNSPECIFIED BOTTOM LUCENT TECHNOLOGIES INC , unknown 8542.39.00.01
DS3170+
Maxim Integrated Products
Check for Price Yes Yes Obsolete 3.3 V FRAMER 1 145 mA COMMERCIAL S-PBGA-B100 e3 Not Qualified 3 70 °C 100 PLASTIC/EPOXY LBGA BGA100,10X10,40 SQUARE GRID ARRAY, LOW PROFILE YES MATTE TIN BALL 1 mm BOTTOM 11 mm 11 mm 1.5 mm MAXIM INTEGRATED PRODUCTS INC BGA 11 X 11 MM, 1.40 MM THICKNESS, 1 MM PITCH, CSBGA-100 100 compliant 8542.39.00.01 EAR99
DS2151QN/T&R
Maxim Integrated Products
Check for Price No No Obsolete 5 V CMOS T-1(DS1) FRAMER 1 INDUSTRIAL S-PQCC-J44 e0 Not Qualified 3 85 °C -40 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC LCC 0.652 INCH, PLASTIC, LCC-44 44 not_compliant 8542.39.00.01
DS3134
Rochester Electronics LLC
Check for Price No No Active 3.3 V CMOS FRAMER 1 COMMERCIAL S-PBGA-B256 e0 COMMERCIAL NOT SPECIFIED 70 °C 225 NOT SPECIFIED 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 27 mm 27 mm 2.34 mm ROCHESTER ELECTRONICS LLC BGA 27 X 27 MM, PLASTIC, BGA-256 256 unknown
PM4354-PI
PMC-Sierra Inc
Check for Price No Obsolete 2.5 V CMOS CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 INDUSTRIAL S-PBGA-B208 e0 Not Qualified 3 85 °C -40 °C 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 1.97 mm PMC-SIERRA INC 17 X 17 MM, 1.76 MM HEIGHT, PLASTIC, BGA-208 unknown