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11 - 20 of 1,403 results
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CN8330EPJD
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 175 µA | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 5.08 mm | CONEXANT SYSTEMS | LCC | QCCJ, LDCC68,1.0SQ | 68 | unknown | 8542.39.00.01 | |||||||||
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TP3155V/NOPB
Texas Instruments
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Check for Price | Yes | Obsolete | 5 V | CMOS | TIME SLOT ASSIGNER | 1 | 1.5 mA | COMMERCIAL | S-PQCC-J20 | e3 | Not Qualified | 3 | 70 °C | 260 | 40 | 20 | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 8.89 mm | 8.89 mm | 4.57 mm | NATIONAL SEMICONDUCTOR CORP | QCCJ, LDCC20,.4SQ | compliant | 8542.39.00.01 | |||||||||
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DS2154LA2+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PQFP-G100 | e3 | Not Qualified | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | LFQFP, | 100 | compliant | 8542.39.00.01 | ||||||||
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BT8376EPF
Mindspeed Technologies Inc
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 175 mA | INDUSTRIAL | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 80 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.3 mm | MINDSPEED TECHNOLOGIES INC | QFP | QFP, | 80 | compliant | 8542.39.00.01 | |||||||||
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T8105---BAL3-BB
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | 275 µA | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | BGA | BGA217,17X17,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | AGERE SYSTEMS INC | BGA | BGA, BGA217,17X17,50 | 217 | unknown | 8542.39.00.01 | ||||||||
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TTSI2K32T
LSI Corporation
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Check for Price | No | Transferred | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | X-PBGA-X217 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | BGA | UNSPECIFIED | GRID ARRAY | YES | UNSPECIFIED | BOTTOM | LUCENT TECHNOLOGIES INC | , | unknown | 8542.39.00.01 | |||||||||||||||||||
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DS3170+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | FRAMER | 1 | 145 mA | COMMERCIAL | S-PBGA-B100 | e3 | Not Qualified | 3 | 70 °C | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | MATTE TIN | BALL | 1 mm | BOTTOM | 11 mm | 11 mm | 1.5 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 11 X 11 MM, 1.40 MM THICKNESS, 1 MM PITCH, CSBGA-100 | 100 | compliant | 8542.39.00.01 | EAR99 | ||||||||
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DS2151QN/T&R
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.572 mm | MAXIM INTEGRATED PRODUCTS INC | LCC | 0.652 INCH, PLASTIC, LCC-44 | 44 | not_compliant | 8542.39.00.01 | |||||||
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DS3134
Rochester Electronics LLC
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Check for Price | No | No | Active | 3.3 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PBGA-B256 | e0 | COMMERCIAL | NOT SPECIFIED | 70 °C | 225 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.34 mm | ROCHESTER ELECTRONICS LLC | BGA | 27 X 27 MM, PLASTIC, BGA-256 | 256 | unknown | |||||||||
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PM4354-PI
PMC-Sierra Inc
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Check for Price | No | Obsolete | 2.5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B208 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.97 mm | PMC-SIERRA INC | 17 X 17 MM, 1.76 MM HEIGHT, PLASTIC, BGA-208 | unknown |