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21 - 30 of 1,403 results
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LXP2180ANE
Intel Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | 10 mA | INDUSTRIAL | R-PDIP-T40 | e0 | Not Qualified | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 5.84 mm | INTEL CORP | DIP | DIP, DIP40,.6 | 40 | compliant | 8542.39.00.01 | ||||||||||||
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AM79C031JC
AMD
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Check for Price | No | Obsolete | 5 V | CMOS | TIME SLOT ASSIGNER | A-LAW | YES | 16-BIT | -5 V | 1 | COMMERCIAL | R-PQCC-J32 | e0 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.43 mm | 13.97 mm | 3.556 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | unknown | 8542.39.00.01 | ||||||||||
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DS2182AQ
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PQCC-J28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | QLCC | QCCJ, LDCC28,.5SQ | 28 | not_compliant | 8542.39.00.01 | |||||||||||||
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MT8979APR1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 5 V | CMOS | FRAMER | 1 | 16 mA | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MICROSEMI CORP | LPCC | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | 44 | compliant | 8542.39.00.01 | ||||||||||||
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DS2180AQN+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | LCC | QCCJ, | 44 | compliant | 8542.39.00.01 | EAR99 | ||||||||||
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DS2181AQ/T&R
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 10 mA | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 70 °C | 240 | 20 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | LCC | PLASTIC, LCC-44 | 44 | not_compliant | 8542.39.00.01 | EAR99 | |||||||||
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LXP302NC
Level One
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 15 mA | COMMERCIAL | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | LEVEL ONE | DIP, DIP28,.6 | unknown | 8542.39.00.01 | ||||||||||||||||||
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DS26519G+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.8 V | CEPT PCM-30/E-1 | FRAMER | 1 | 925 mA | COMMERCIAL | S-PBGA-B484 | e1 | Not Qualified | 3 | 70 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, HSBGA-484 | 484 | unknown | 8542.39.00.01 | |||||||||
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KT8580
Samsung Semiconductor
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Check for Price | Obsolete | TIME SLOT ASSIGNER | 1 | S-PQCC-J28 | Not Qualified | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.53 mm | 11.53 mm | 4.52 mm | SAMSUNG SEMICONDUCTOR INC | QLCC | QCCJ, | 28 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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XRT86SH328IB
Exar Corporation
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Check for Price | No | No | Obsolete | 1.8 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B568 | e0 | Not Qualified | 85 °C | -40 °C | 568 | PLASTIC/EPOXY | BGA | BGA568,30X30,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 31 mm | 31 mm | 2.7 mm | EXAR CORP | BGA | 31 X 31 MM, PLASTIC, BGA-568 | 568 | compliant | 8542.39.00.01 |