Parametric results for: ds26518 under Digital Transmission Controllers
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DS2155GN
Dallas Semiconductor
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Check for Price | Transferred | 3.3 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B100 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | DALLAS SEMICONDUCTOR | CSBGA-100 | unknown | |||||||||||||||||||||||||||
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DS26514
Maxim Integrated Products
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Check for Price | No | No | Transferred | 1.8 V | FRAMER | 1 | INDUSTRIAL | S-XBGA-B256 | e0 | Not Qualified | 85 °C | -40 °C | 256 | UNSPECIFIED | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | 17 X 17 MM, 1.00 MM, PITCH, TE-CSBGA-256 | compliant | BGA | 256 | EAR99 | 8542.39.00.01 | ||||||||||||||
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DS2180AQN+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | QCCJ, | compliant | LCC | 44 | EAR99 | 8542.39.00.01 | |||||||||||
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T7111A-EC
LSI Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 55 mA | COMMERCIAL | R-PDSO-J28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SOJ | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | DUAL | AGERE SYSTEMS INC | SOJ, SOJ28,.34 | unknown | 8542.39.00.01 | |||||||||||||||||||
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TSS933EBM883
Temic Semiconductors
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Check for Price | No | Transferred | 5 V | BICMOS | FRAMER | 1 | MILITARY | S-XQCC-J28 | e0 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | UNSPECIFIED | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | TEMIC SEMICONDUCTORS | LCC-28 | unknown | |||||||||||||||||||
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AM79C031JC
AMD
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Check for Price | No | Obsolete | 5 V | CMOS | TIME SLOT ASSIGNER | A-LAW | YES | 16-BIT | -5 V | 1 | COMMERCIAL | R-PQCC-J32 | e0 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.43 mm | 13.97 mm | 3.556 mm | ADVANCED MICRO DEVICES INC | QCCJ, LDCC32,.5X.6 | unknown | QFJ | 32 | 8542.39.00.01 | |||||||||||
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LXP2180ANE
Intel Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | 10 mA | INDUSTRIAL | R-PDIP-T40 | e0 | Not Qualified | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 5.84 mm | INTEL CORP | DIP, DIP40,.6 | compliant | DIP | 40 | 8542.39.00.01 | |||||||||||||
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PEB2256
Siemens
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Check for Price | Transferred | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | SIEMENS A G | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||
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LXP302NC
Level One
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 15 mA | COMMERCIAL | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | LEVEL ONE | DIP, DIP28,.6 | unknown | 8542.39.00.01 | |||||||||||||||||||
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DS26519GN+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.8 V | CEPT PCM-30/E-1 | FRAMER | 1 | 925 mA | INDUSTRIAL | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | MAXIM INTEGRATED PRODUCTS INC | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, HSBGA-484 | compliant | BGA | 484 | EAR99 | 8542.39.00.01 |