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Parametric results for: ds26518 under Digital Transmission Controllers

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MT9074AP
 Microsemi Corporation 		Check for Price No No Obsolete 5 V CMOS FRAMER 1 200 mA INDUSTRIAL S-PQCC-J68 e0 Not Qualified 85 °C -40 °C 68 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 4.57 mm MICROSEMI CORP LCC PLASTIC, MS-018AE, LCC-68 68 unknown 8542.39.00.01
DS2154LA2+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS FRAMER 1 COMMERCIAL S-PQFP-G100 e3 Not Qualified 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm MAXIM INTEGRATED PRODUCTS INC QFP LFQFP, 100 compliant 8542.39.00.01
CN8394KTF
 Conexant Systems Inc 		Check for Price No Transferred 3.3 V CMOS FRAMER 90 mA COMMERCIAL R-PQFP-G128 e0 Not Qualified 70 °C 128 PLASTIC/EPOXY QFP QFP128,.63X.87,20 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD CONEXANT SYSTEMS QFP, QFP128,.63X.87,20 compliant 8542.39.00.01
IDT82V8313DSG
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 3.3 V FRAMER 1 185 mA INDUSTRIAL S-PQFP-G208 e3 Not Qualified 85 °C -40 °C 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 28 mm 28 mm 4.1 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 208 compliant 8542.39.00.01
TTSI016641BL-1
 LSI Corporation 		Check for Price No Transferred 1.5 V TIME SLOT ASSIGNER 1 INDUSTRIAL S-PBGA-B324 Not Qualified 85 °C -40 °C 324 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL 1 mm BOTTOM 23 mm 23 mm 2.51 mm AGERE SYSTEMS INC BGA BGA, 324 unknown 8542.39.00.01
BT9170KP
 Conexant Systems Inc 		Check for Price Obsolete 5 V CMOS FRAMER 1 15 mA COMMERCIAL R-PDIP-T40 Not Qualified 70 °C 40 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL BROOKTREE CORP , unknown 8542.39.00.01
PEB2255-H
 Infineon Technologies AG 		Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 140 mA INDUSTRIAL S-PQFP-G80 e0 Not Qualified 85 °C -40 °C 80 PLASTIC/EPOXY QFP QFP80,.7SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 14 mm 14 mm 2.45 mm INFINEON TECHNOLOGIES AG QFP PLASTIC, MQFP-80 80 not_compliant 8542.39.00.01
PEF22554HT
 Intel Corporation 		Check for Price Yes Contact Manufacturer 1.8 V FRAMER 1 230 mA INDUSTRIAL S-PBGA-B160 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 160 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 15 mm 15 mm 1.6 mm INTEL CORP GREEN, PLASTIC, LBGA-160 compliant 8542.39.00.01
TXC-03401-ABA
 Transwitch Corporation 		Check for Price No Obsolete 5 V CMOS FRAMER 1 150 mA S-PQCC-J68 e0 Not Qualified 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD TRANSWITCH CORP QCCJ, LDCC68,1.0SQ unknown 8542.39.00.01
DS2182N
 Rochester Electronics LLC 		Check for Price No No Active 5 V CMOS FRAMER 1 COMMERCIAL R-PDIP-T28 e0 COMMERCIAL 1 70 °C 245 NOT SPECIFIED 28 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 15.24 mm 36.83 mm 5.08 mm ROCHESTER ELECTRONICS LLC DIP 0.600 INCH, DIP-28 28 unknown
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