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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: burst under Cordless Telephone ICs

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MC145165D
 Freescale Semiconductor 		Check for Price No Obsolete CMOS 2/3.3 V OTHER R-PDSO-G16 e0 Not Qualified 70 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL MOTOROLA SEMICONDUCTOR PRODUCTS SOP, SOP16,.25 unknown
MC13109FB
 Motorola Mobility LLC 		Check for Price No Obsolete 2.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 12 mA OTHER S-PQFP-G52 e0 Not Qualified 85 °C -20 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown QFP 52 8542.39.00.01
U3550BM-AFLG3
 Atmel Corporation 		Check for Price Transferred 3.6 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G28 Not Qualified 75 °C -25 °C 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 7.4 mm 17.925 mm ATMEL CORP SOP, unknown SOIC 28 8542.39.00.01
U3502BM-AFL
 Atmel Corporation 		Check for Price No Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.7 µA COMMERCIAL EXTENDED R-PDSO-G24 e0 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SOP SOP24,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 7.4 mm 15.425 mm 2.6 mm ATMEL CORP SOP, SOP24,.4 unknown SOIC 24 8542.39.00.01
TA31136FN-TP1
 Toshiba America Electronic Components 		Check for Price Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5 mm 1.6 mm TOSHIBA CORP LSSOP, unknown SOIC 16 8542.39.00.01
TK10665QCMG
 TOKO Inc 		Check for Price Obsolete 2.6 V CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 COMMERCIAL EXTENDED S-PQFP-G48 Not Qualified 75 °C -10 °C 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.7 mm TOKO INC LFQFP, unknown 8542.39.00.01
TEA1118AT
 Philips Semiconductors 		Check for Price No Transferred 2.9 V BIPOLAR 1.4 mA OTHER R-PDSO-G14 e0 Not Qualified 70 °C -25 °C 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL PHILIPS SEMICONDUCTORS SOP, SOP14,.25 unknown 8542.39.00.01
MC13110AFB
 Freescale Semiconductor 		Check for Price Transferred 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-PQFP-G52 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm FREESCALE SEMICONDUCTOR INC QFP, unknown QFP 52 8542.39.00.01 EAR99
SC14408B80VD
 National Semiconductor Corporation 		Check for Price No Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G80 e0 Not Qualified 80 PLASTIC/EPOXY QFP QFP80,.68SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 14 mm 14 mm 2.35 mm NATIONAL SEMICONDUCTOR CORP QFP, QFP80,.68SQ unknown 8542.39.00.01
TA31136FN
 Toshiba America Electronic Components 		Check for Price Obsolete 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5 mm 1.6 mm TOSHIBA CORP LSSOP, unknown SOIC 16 8542.39.00.01 Toshiba
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