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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: mc1310pb under Cordless Telephone ICs

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AK2353LV
 Asahi Kasei Microsystems Corporation 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 9.4 mA COMMERCIAL S-PQFP-G64 e0 Not Qualified 70 °C -10 °C 64 PLASTIC/EPOXY QFP QFP64,.47SQ,20 SQUARE FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD ASAHI KASEI MICRODEVICES CORP QFP, QFP64,.47SQ,20 unknown 8542.39.00.01
U2785B-MFSG3
 Temic Semiconductors 		Check for Price No Transferred 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING DUAL TEMIC SEMICONDUCTORS SSO-28 unknown
U2762B-BFS
 Telefunken Microelectronics Gmbh 		Check for Price No Transferred 2.9 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT COMMERCIAL R-PDSO-G28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL TELEFUNKEN MICROELECTRONICS GMBH unknown 8542.39.00.01
UA31136G-P16-R
 Unisonic Technologies Co Ltd 		Check for Price Yes Active 2 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G16 85 °C -30 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5.075 mm 1.2 mm UNISONIC TECHNOLOGIES CO LTD HALOGEN FREE, TSSOP-16 compliant 8542.39.00.01 TSSOP 16
SM5130D1P
 Seiko NPC Corporation 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 mA COMMERCIAL EXTENDED R-PDIP-T18 Not Qualified 80 °C -30 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL SEIKO NPC CORP DIP, DIP18,.3 unknown 8542.39.00.01
SC14404BFLAG
 Texas Instruments 		Check for Price Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY FQFP QFP100,.63SQ,20 SQUARE FLATPACK, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.758 mm NATIONAL SEMICONDUCTOR CORP FQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
TEA1118AT
 NXP Semiconductors 		Check for Price No Obsolete 2.9 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G14 e4 Not Qualified 75 °C -25 °C 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 3.9 mm 8.65 mm 1.75 mm NXP SEMICONDUCTORS SOP, SOP14,.25 unknown 8542.39.00.01 SOIC 14
PCD5041H
 Philips Semiconductors 		Check for Price No Transferred CMOS 12 mA OTHER R-PQFP-G64 e0 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 1 mm QUAD PHILIPS SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
UAA2067G-T
 NXP Semiconductors 		Check for Price Obsolete 3.6 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER S-PQFP-G32 Not Qualified 85 °C -30 °C 32 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 5 mm 5 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
CXG1097EN
 Sony Semiconductor 		Check for Price Yes Yes Obsolete 2.7 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 17 mA OTHER R-XDSO-N16 e6 Not Qualified 85 °C -35 °C 260 10 16 UNSPECIFIED VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES Tin/Bismuth (Sn/Bi) NO LEAD 400 µm DUAL 2.5 mm 3.5 mm 900 µm SONY CORP VSON, unknown 8542.39.00.01 SON 16
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