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Parametric results for: burst under Cordless Telephone ICs

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SC14404BXXAG
 National Semiconductor Corporation 		Check for Price Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY FQFP QFP100,.63SQ,20 SQUARE FLATPACK, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.758 mm NATIONAL SEMICONDUCTOR CORP FQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
NCL354TMX
 National Semiconductor Corporation 		Check for Price Obsolete 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G56 Not Qualified 80 °C -30 °C 56 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 6.1 mm 14 mm 1.1 mm NATIONAL SEMICONDUCTOR CORP TSSOP, unknown 8542.39.00.01
UAA2067G-T
 NXP Semiconductors 		Check for Price Obsolete 3.6 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER S-PQFP-G32 Not Qualified 85 °C -30 °C 32 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 5 mm 5 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
SC14422DVJG
 Texas Instruments 		Check for Price Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, unknown 8542.39.00.01
KS8803B
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP, DIP16,.3 compliant 8542.39.00.01 DIP 16
TRM7F-J01H
 Mitsumi Electric Co Ltd 		Check for Price Obsolete 2.4 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 52 mA R-XXMA-X17 Not Qualified 17 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED MITSUMI ELECTRIC CO LTD , unknown 8542.39.00.01
U2801B-MFY
 Temic Semiconductors 		Check for Price No Transferred 3.2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 OTHER S-PQFP-G48 e0 Not Qualified 85 °C -25 °C 48 PLASTIC/EPOXY QFP QFP48,.35SQ,20 SQUARE FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD TEMIC SEMICONDUCTORS TQFP-48 unknown
MC13109FB
 Motorola Mobility LLC 		Check for Price No Obsolete 2.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 12 mA OTHER S-PQFP-G52 e0 Not Qualified 85 °C -20 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown 8542.39.00.01 QFP 52
BU8241FE1
 ROHM Semiconductor 		Check for Price Yes Yes Active 5 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 8 mA R-PDSO-G24 e3/e2 Not Qualified 260 10 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 15 mm 1.9 mm ROHM CO LTD SOP, compliant 8542.39.00.01 SOIC 24
TRM5F-J
 Mitsumi Electric Co Ltd 		Check for Price Obsolete 2.4 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 52 mA R-XXMA-X Not Qualified UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED MITSUMI ELECTRIC CO LTD , unknown 8542.39.00.01
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