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U2762B-BFSG3
Temic Semiconductors
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Check for Price | No | Transferred | 2.9 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | TEMIC SEMICONDUCTORS | SSO-28 | unknown | ||||||||||||
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NCL354TMX
National Semiconductor Corporation
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Check for Price | Obsolete | 3.3 V | CMOS | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G56 | Not Qualified | 80 °C | -30 °C | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 6.1 mm | 14 mm | 1.1 mm | NATIONAL SEMICONDUCTOR CORP | TSSOP, | unknown | 8542.39.00.01 | |||||||||||
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TA31102F-TP1
Toshiba America Electronic Components
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Check for Price | No | No | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | OTHER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SSOP, | unknown | 8542.39.00.01 | SOIC | 16 | |||||
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U2761B
Atmel Corporation
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Check for Price | No | Obsolete | 3 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | OTHER | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -25 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 9.055 mm | ATMEL CORP | SSOP, SSOP28,.25 | unknown | 8542.39.00.01 | SOIC | 28 | ||||||
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935237440118
NXP Semiconductors
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Check for Price | Obsolete | 2.9 V | BIPOLAR | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | 1.4 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5.2 mm | 1.5 mm | NXP SEMICONDUCTORS | LSSOP, | unknown | 8542.39.00.01 | SOIC | 16 | ||||||||
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MSM7586-01TS-K
LAPIS Semiconductor Co Ltd
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Check for Price | Obsolete | 3 V | CMOS | 384 Mbps | MODEM | 1 | 28 mA | OTHER | S-PQFP-G100 | Not Qualified | 70 °C | -25 °C | 100 | PLASTIC/EPOXY | QFP | TQFP100,.63SQ | SQUARE | FLATPACK | YES | GULL WING | 500 µm | QUAD | LAPIS SEMICONDUCTOR CO LTD | QFP, TQFP100,.63SQ | unknown | 8542.39.00.01 | |||||||||||
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SC14422DRVJG
Texas Instruments
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Check for Price | Obsolete | 3 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G100 | Not Qualified | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | NATIONAL SEMICONDUCTOR CORP | LFQFP, | unknown | 8542.39.00.01 | ||||||||||||||
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KS8803B
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDIP-T16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.4 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP, DIP16,.3 | compliant | 8542.39.00.01 | DIP | 16 | ||||
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AD6190ARS
Analog Devices Inc
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Check for Price | No | Obsolete | 3.3 V | BIPOLAR | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | OTHER | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -20 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | DUAL | 5.3 mm | 10.2 mm | 2 mm | ANALOG DEVICES INC | SSOP-28 | unknown | 8542.39.00.01 | SSOP | 28 | |||||
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TRM7F-J01H
Mitsumi Electric Co Ltd
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Check for Price | Obsolete | 2.4 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 52 mA | R-XXMA-X17 | Not Qualified | 17 | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | MITSUMI ELECTRIC CO LTD | , | unknown | 8542.39.00.01 |