Parametric results for: mc1310pb under Cordless Telephone ICs

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U2762B-BFSG3
Temic Semiconductors
Check for Price No Transferred 2.9 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL R-PDSO-G28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL TEMIC SEMICONDUCTORS SSO-28 unknown
NCL354TMX
National Semiconductor Corporation
Check for Price Obsolete 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G56 Not Qualified 80 °C -30 °C 56 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 6.1 mm 14 mm 1.1 mm NATIONAL SEMICONDUCTOR CORP TSSOP, unknown 8542.39.00.01
TA31102F-TP1
Toshiba America Electronic Components
Check for Price No No Active 5 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 6 mA OTHER R-PDSO-G16 e0 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SSOP, unknown 8542.39.00.01 SOIC 16
U2761B
Atmel Corporation
Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 9.055 mm ATMEL CORP SSOP, SSOP28,.25 unknown 8542.39.00.01 SOIC 28
935237440118
NXP Semiconductors
Check for Price Obsolete 2.9 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G16 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5.2 mm 1.5 mm NXP SEMICONDUCTORS LSSOP, unknown 8542.39.00.01 SOIC 16
MSM7586-01TS-K
LAPIS Semiconductor Co Ltd
Check for Price Obsolete 3 V CMOS 384 Mbps MODEM 1 28 mA OTHER S-PQFP-G100 Not Qualified 70 °C -25 °C 100 PLASTIC/EPOXY QFP TQFP100,.63SQ SQUARE FLATPACK YES GULL WING 500 µm QUAD LAPIS SEMICONDUCTOR CO LTD QFP, TQFP100,.63SQ unknown 8542.39.00.01
SC14422DRVJG
Texas Instruments
Check for Price Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, unknown 8542.39.00.01
KS8803B
Samsung Semiconductor
Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP, DIP16,.3 compliant 8542.39.00.01 DIP 16
AD6190ARS
Analog Devices Inc
Check for Price No Obsolete 3.3 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -20 °C 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm ANALOG DEVICES INC SSOP-28 unknown 8542.39.00.01 SSOP 28
TRM7F-J01H
Mitsumi Electric Co Ltd
Check for Price Obsolete 2.4 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 52 mA R-XXMA-X17 Not Qualified 17 UNSPECIFIED XMA RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED MITSUMI ELECTRIC CO LTD , unknown 8542.39.00.01