Parametric results for: Analog Transmission Interfaces

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AM79572DC
AMD
Check for Price No Obsolete SLIC 1 COMMERCIAL R-CDIP-T28 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 28 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 15.24 mm 37.1475 mm 5.588 mm ADVANCED MICRO DEVICES INC DIP DIP, 28 unknown 8542.39.00.01
LE79R241QC
Microsemi Corporation
Check for Price No Transferred 5 V BIPOLAR 11 dBrnC SLIC -15 TO -99 V 1 25 dB 10 mA COMMERCIAL S-XQCC-N32 Not Qualified 70 °C 32 UNSPECIFIED HVQCCN LCC32,.32SQ,32 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 800 µm QUAD 8 mm 8 mm 1 mm MICROSEMI CORP QFN 8 X 8 MM, MO-220, QFN-32 32 unknown 8542.39.00.01
AM7920-1JC
Legerity
Check for Price No Transferred 5 V SLIC 1 COMMERCIAL R-PQCC-J32 Not Qualified 3 70 °C 235 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES J BEND 1.27 mm QUAD 11.43 mm 13.97 mm 3.556 mm LEGERITY INC QFJ QCCJ, 32 unknown 8542.39.00.01
AM79M576AJC
AMD
Check for Price No Transferred 5 V SLIC RESISTIVE -46.4 TO -54 V 2-4 CONVERSION -5 V 1 18 dB 9 mA COMMERCIAL R-PQCC-J32 e0 Not Qualified 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 11.43 mm 13.97 mm 3.556 mm ADVANCED MICRO DEVICES INC QFJ QCCJ, LDCC32,.5X.6 32 unknown 8542.39.00.01
HC9P5504B1-5
Harris Semiconductor
Check for Price No Obsolete 12 V BIPOLAR 5 dBrnC SLIC CONSTANT CURRENT -48 V 2-4 CONVERSION -48 V 1 15 dB 41 mA COMMERCIAL EXTENDED R-PDSO-G24 e0 Not Qualified 75 °C 24 PLASTIC/EPOXY SOP SOP24,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL HARRIS SEMICONDUCTOR SOP, SOP24,.4 unknown 8542.39.00.01
LUCL7585FP-D
Zarlink Semiconductor Inc
Check for Price Transferred 5 V BCDMOS SLIC 1 INDUSTRIAL S-PQCC-J44 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES J BEND 1.27 mm QUAD 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, unknown 8542.39.00.01
PBL3764A/4J
Ericsson
Check for Price Transferred 5 V SLIC -5 V 1 9.5 mA INDUSTRIAL R-GDIP-T22 Not Qualified 85 °C -40 °C 22 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 10.16 mm 27.84 mm 5.08 mm ERICSSON POWER MODULES AB DIP DIP, 22 unknown 8542.39.00.01
LE9500DBJC
Microsemi Corporation
Check for Price Yes Yes Obsolete 3.3 V SLIC 1 COMMERCIAL S-PQCC-J28 Not Qualified 70 °C 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES J BEND 1.27 mm QUAD 11.5062 mm 11.5062 mm 4.572 mm MICROSEMI CORP LCC GREEN, PLASTIC, MS-018AB, LCC-28 28 compliant 8542.39.00.01
LE57D111BTC
Zarlink Semiconductor Inc
Check for Price Yes Transferred 5 V 12 dBrnC SLIC CONSTANT CURRENT -39 TO -58 V 1 28 dB 12 µA INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm ZARLINK SEMICONDUCTOR INC HTQFP, TQFP44,.47SQ,32 unknown 8542.39.00.01
AM7947JC
AMD
Check for Price No Obsolete 5 V 14 dBrnC SLIC CONSTANT CURRENT -38.9 TO -58 V 2-4 CONVERSION -5 V 1 28 dB 8.5 mA COMMERCIAL R-PQCC-J32 e0 Not Qualified 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.43 mm 13.97 mm 3.556 mm ADVANCED MICRO DEVICES INC QFJ QCCJ, LDCC32,.5X.6 32 compliant 8542.39.00.01