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1 - 10 of 4,441 results
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AM79572DC
AMD
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Check for Price | No | Obsolete | SLIC | 1 | COMMERCIAL | R-CDIP-T28 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 37.1475 mm | 5.588 mm | ADVANCED MICRO DEVICES INC | DIP | DIP, | 28 | unknown | 8542.39.00.01 | |||||||||||||||||
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LE79R241QC
Microsemi Corporation
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Check for Price | No | Transferred | 5 V | BIPOLAR | 11 dBrnC | SLIC | -15 TO -99 V | 1 | 25 dB | 10 mA | COMMERCIAL | S-XQCC-N32 | Not Qualified | 70 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.32SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 800 µm | QUAD | 8 mm | 8 mm | 1 mm | MICROSEMI CORP | QFN | 8 X 8 MM, MO-220, QFN-32 | 32 | unknown | 8542.39.00.01 | ||||||||||||
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AM7920-1JC
Legerity
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Check for Price | No | Transferred | 5 V | SLIC | 1 | COMMERCIAL | R-PQCC-J32 | Not Qualified | 3 | 70 °C | 235 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.43 mm | 13.97 mm | 3.556 mm | LEGERITY INC | QFJ | QCCJ, | 32 | unknown | 8542.39.00.01 | ||||||||||||||||
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AM79M576AJC
AMD
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Check for Price | No | Transferred | 5 V | SLIC | RESISTIVE | -46.4 TO -54 V | 2-4 CONVERSION | -5 V | 1 | 18 dB | 9 mA | COMMERCIAL | R-PQCC-J32 | e0 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 11.43 mm | 13.97 mm | 3.556 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | unknown | 8542.39.00.01 | |||||||||
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HC9P5504B1-5
Harris Semiconductor
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Check for Price | No | Obsolete | 12 V | BIPOLAR | 5 dBrnC | SLIC | CONSTANT CURRENT | -48 V | 2-4 CONVERSION | -48 V | 1 | 15 dB | 41 mA | COMMERCIAL EXTENDED | R-PDSO-G24 | e0 | Not Qualified | 75 °C | 24 | PLASTIC/EPOXY | SOP | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | HARRIS SEMICONDUCTOR | SOP, SOP24,.4 | unknown | 8542.39.00.01 | ||||||||||||
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LUCL7585FP-D
Zarlink Semiconductor Inc
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Check for Price | Transferred | 5 V | BCDMOS | SLIC | 1 | INDUSTRIAL | S-PQCC-J44 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.57 mm | ZARLINK SEMICONDUCTOR INC | QCCJ, | unknown | 8542.39.00.01 | |||||||||||||||||||
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PBL3764A/4J
Ericsson
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Check for Price | Transferred | 5 V | SLIC | -5 V | 1 | 9.5 mA | INDUSTRIAL | R-GDIP-T22 | Not Qualified | 85 °C | -40 °C | 22 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 10.16 mm | 27.84 mm | 5.08 mm | ERICSSON POWER MODULES AB | DIP | DIP, | 22 | unknown | 8542.39.00.01 | ||||||||||||||||
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LE9500DBJC
Microsemi Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | SLIC | 1 | COMMERCIAL | S-PQCC-J28 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.5062 mm | 11.5062 mm | 4.572 mm | MICROSEMI CORP | LCC | GREEN, PLASTIC, MS-018AB, LCC-28 | 28 | compliant | 8542.39.00.01 | |||||||||||||||||
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LE57D111BTC
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | 12 dBrnC | SLIC | CONSTANT CURRENT | -39 TO -58 V | 1 | 28 dB | 12 µA | INDUSTRIAL | S-PQFP-G44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | HTQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | ZARLINK SEMICONDUCTOR INC | HTQFP, TQFP44,.47SQ,32 | unknown | 8542.39.00.01 | |||||||||||
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AM7947JC
AMD
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Check for Price | No | Obsolete | 5 V | 14 dBrnC | SLIC | CONSTANT CURRENT | -38.9 TO -58 V | 2-4 CONVERSION | -5 V | 1 | 28 dB | 8.5 mA | COMMERCIAL | R-PQCC-J32 | e0 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.43 mm | 13.97 mm | 3.556 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | compliant | 8542.39.00.01 |