Parametric results for: TEL+3-4823 under ATM/SONET/SDH ICs
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ONET8541TY
Texas Instruments
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$3.4188 | No | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | Data rate is 11.3 Gbps | SONET | 1 | 40 mA | INDUSTRIAL | R-XUUC-N18 | Not Qualified | 100 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 18 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | 870 µm | 1.036 mm | TEXAS INSTRUMENTS INC | DIE | DIE-18 | 18 | compliant | 8542.39.00.01 | |||||||||||
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SY88943VKG
Microchip Technology Inc
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$3.4212 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 45 mA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | 3 MM, LEAD FREE, MSOP-10 | compliant | 8542.39.00.01 | EAR99 | Microchip | |||||||
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SY88993AVKG
Micrel Inc
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$3.5300 | Yes | Transferred | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 65 µA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICREL INC | 3 X 3 MM, LEAD FREE, MSOP-10 | compliant | |||||||||
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ONET8541TYS4
Texas Instruments
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$3.6036 | No | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | Data rate is 11.3 Gbps | 1 | 40 mA | INDUSTRIAL | R-XUUC-N | 100 °C | -40 °C | 18 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | 870 µm | 1.036 mm | TEXAS INSTRUMENTS INC | DIE, | compliant | |||||||||||||||||||
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SY88073LMG
Microchip Technology Inc
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$3.7001 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SONET | 1 | 75 mA | INDUSTRIAL | S-XQCC-N16 | e4 | 2 | 85 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | Microchip | ||||||||
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SY88083LMG
Microchip Technology Inc
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$3.7001 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 75 mA | INDUSTRIAL | S-XQCC-N16 | e4 | 2 | 85 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | Microchip | ||||||||
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MAX3969ETP+
Maxim Integrated Products
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$3.8786 | Yes | Yes | Transferred | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | ATM | 1 | 45 µA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.16SQ,20 | 20 | compliant | 8542.33.00.01 | EAR99 | ||||
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SY88347DLEY
Micrel Inc
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$3.9100 | Yes | Transferred | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 60 µA | INDUSTRIAL | S-PDSO-G10 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICREL INC | LEAD FREE, EXPOSED PAD, MSOP-10 | compliant | |||||||||
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SY88149HALMG
Microchip Technology Inc
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$3.9422 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 80 mA | INDUSTRIAL | S-XQCC-N16 | e4 | 2 | 85 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 3 X 3 MM, LEAD FREE, QFN-16 | compliant | 8542.39.00.01 | EAR99 | |||||||||
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MIC3001GML-TR
Microchip Technology Inc
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$3.9437 | Yes | Not Recommended | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 3.5 mA | INDUSTRIAL | S-XQCC-N24 | e4 | Not Qualified | 2 | 105 °C | -40 °C | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 4 X 4 MM, LEAD FREE, MLF-24 | compliant | 8542.39.00.01 | EAR99 | Microchip |