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LCMXO2-256ZE-1SG32C
Lattice Semiconductor Corporation
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$5.2523 | Yes | Active | 1.2 V | 21 | 21 | 256 | 32 | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | 32 CLBS | 93.7 MHz | 1.26 V | 1.14 V | S-XQCC-N32 | Not Qualified | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TRAY | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 600 µm | LATTICE SEMICONDUCTOR CORP | QFN-32 | compliant | EAR99 | 8542.39.00.01 | Lattice Semiconductor | ||||||||||||||
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LCMXO2-256HC-5SG32C
Lattice Semiconductor Corporation
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$5.3371 | Yes | Active | 2.5 V | 21 | 21 | 256 | 32 | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | 32 CLBS | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 139 MHz | 3.465 V | 2.375 V | S-XQCC-N32 | Not Qualified | e3 | 3 | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TRAY | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 600 µm | LATTICE SEMICONDUCTOR CORP | HVQCCN, LCC32,.2SQ,20 | compliant | EAR99 | 8542.39.00.01 | Lattice Semiconductor | ||||||||||
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XC6SLX4-2CSG225C
AMD Xilinx
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$5.3660 | Yes | Yes | Transferred | 1.2 V | 120 | 120 | 3840 | 300 | 260 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 300 CLBS | 667 MHz | 1.26 V | 1.14 V | S-PBGA-B225 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 225 | PLASTIC/EPOXY | LFBGA | BGA225,15X15,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 13 mm | 13 mm | 1.4 mm | XILINX INC | 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225 | compliant | EAR99 | 8542.39.00.01 | BGA | 225 | ||||||||
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A3PN015-2QNG68
Microchip Technology Inc
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$5.3953 | Yes | Obsolete | 1.5 V | 49 | 49 | 384 | 15000 | 384 | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 384 CLBS, 15000 GATES | 1.575 V | 1.425 V | S-XQCC-N68 | Not Qualified | 3 | 70 °C | -20 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TRAY | YES | NO LEAD | 400 µm | QUAD | 8 mm | 8 mm | 1 mm | MICROCHIP TECHNOLOGY INC | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | compliant | 8542.39.00.01 | |||||||||||||||
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A3PN020-1QNG68
Microchip Technology Inc
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$5.3953 | Yes | Active | 1.5 V | 20000 | 520 | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 520 CLBS, 20000 GATES | 1.575 V | 1.425 V | S-XQCC-N68 | Not Qualified | 3 | 70 °C | -20 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TRAY | YES | NO LEAD | 400 µm | QUAD | 8 mm | 8 mm | 1 mm | MICROCHIP TECHNOLOGY INC | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | compliant | 8542.39.00.01 | ||||||||||||||||||
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XC3S50A-4FTG256I
AMD Xilinx
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$5.4231 | Yes | Yes | Transferred | 1.2 V | 144 | 112 | 1584 | 50000 | 176 | 710 ps | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 176 CLBS, 50000 GATES | 667 MHz | 1.26 V | 1.14 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 100 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.55 mm | XILINX INC | FTBGA-256 | compliant | EAR99 | 8542.39.00.01 | BGA | 256 | ||||||
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A3PN010-1QNG48I
Microchip Technology Inc
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$5.4333 | Yes | Active | 1.5 V | 10000 | 260 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 260 CLBS, 10000 GATES | 1.575 V | 1.425 V | S-XQCC-N48 | Not Qualified | 3 | 85 °C | -40 °C | 48 | UNSPECIFIED | HQCCN | LCC48,.24SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | TRAY | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | compliant | 8542.39.00.01 | |||||||||||||||||||
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ICE40UL640-CM36AITR1K
Lattice Semiconductor Corporation
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$5.7250 | Active | 1.2 V | 26 | 26 | 640 | 80 | 9 ns | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 80 CLBS | 105.2 MHz | 1.26 V | 1.14 V | S-PBGA-B36 | 100 °C | -40 °C | 36 | PLASTIC/EPOXY | VFBGA | BGA36,6X6,16 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TR | YES | BALL | 400 µm | BOTTOM | 2.5 mm | 2.5 mm | 910 µm | LATTICE SEMICONDUCTOR CORP | UCBGA-36 | compliant | EAR99 | 8542.31.00.01 | Lattice Semiconductor | 2016-07-14 | ||||||||||||||
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XC6SLX9-2FTG256C
AMD Xilinx
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$5.8839 | Yes | Yes | Transferred | 1.2 V | 186 | 186 | 9152 | 715 | 260 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 715 CLBS | 667 MHz | 1.26 V | 1.14 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.55 mm | XILINX INC | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | compliant | EAR99 | 8542.39.00.01 | BGA | 256 | ||||||||
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XC6SLX9-2CSG324C
AMD Xilinx
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$5.8839 | Yes | Yes | Transferred | 1.2 V | 200 | 200 | 9152 | 715 | 260 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 715 CLBS | 667 MHz | 1.26 V | 1.14 V | S-PBGA-B324 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 15 mm | 15 mm | 1.5 mm | XILINX INC | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | compliant | 3A991.D | 8542.39.00.01 | BGA | 324 |