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XC6SLX16-2CSG324I
AMD Xilinx
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$1.6616 | Yes | Yes | Transferred | 1.2 V | 232 | 232 | 14579 | 1139 | 260 ps | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 1139 CLBS | 667 MHz | 1.26 V | 1.14 V | S-PBGA-B324 | Not Qualified | e1 | 3 | 100 °C | -40 °C | 260 | 30 | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 15 mm | 15 mm | 1.5 mm | XILINX INC | BGA | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | 324 | compliant | 3A991.D | 8542.39.00.01 | ||||||
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XC6SLX25-3FTG256C
AMD Xilinx
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$1.7274 | Yes | Yes | Transferred | 1.2 V | 186 | 186 | 24051 | 1879 | 210 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 1879 CLBS | 862 MHz | 1.26 V | 1.14 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.55 mm | XILINX INC | BGA | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | 256 | compliant | EAR99 | 8542.39.00.01 | |||||||
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ICE40LP384-SG32
Lattice Semiconductor Corporation
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$2.2096 | Yes | Active | 1.2 V | 21 | 21 | 384 | 48 | 9.36 ns | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 48 CLBS | 1.26 V | 1.14 V | S-XQCC-N32 | 100 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | LATTICE SEMICONDUCTOR CORP | HVQCCN, | compliant | EAR99 | 8542.31.00.01 | Lattice Semiconductor | ||||||||||||||
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ICE40LP384-CM36
Lattice Semiconductor Corporation
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$2.9900 | Yes | Active | 1.2 V | 25 | 25 | 384 | 48 | 9.36 ns | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 48 CLBS | 1.26 V | 1.14 V | S-PBGA-B36 | e1 | 3 | 100 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 36 | PLASTIC/EPOXY | VFBGA | BGA36,6X6,16 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 2.5 mm | 2.5 mm | 1 mm | LATTICE SEMICONDUCTOR CORP | VFBGA, | compliant | EAR99 | 8542.31.00.01 | Lattice Semiconductor | ||||||||||
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XC3S50AN-4TQG144C
AMD Xilinx
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$3.0255 | Yes | Yes | Transferred | 1.2 V | 108 | 101 | 1584 | 50000 | 176 | 710 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 176 CLBS, 50000 GATES | 667 MHz | 1.26 V | 1.14 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 85 °C | 260 | 30 | 144 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | XILINX INC | QFP | TQFP-144 | 144 | compliant | EAR99 | 8542.39.00.01 | ||||||
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ICE40LP384-CM49
Lattice Semiconductor Corporation
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$3.2350 | Yes | Active | 1.2 V | 37 | 37 | 384 | 48 | 9.36 ns | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 48 CLBS | 1.26 V | 1.14 V | S-PBGA-B49 | e1 | 3 | 100 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 49 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 3 mm | 3 mm | 1 mm | LATTICE SEMICONDUCTOR CORP | VFBGA, | unknown | EAR99 | 8542.31.00.01 | Lattice Semiconductor | |||||||||||
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EP4CE6E22C8N
Altera Corporation
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$3.3680 | Yes | Yes | Transferred | 1.2 V | 91 | 91 | 6272 | 392 | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | 392 CLBS | 472.5 MHz | 1.25 V | 1.15 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 85 °C | 144 | PLASTIC/EPOXY | HLFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.65 mm | ALTERA CORP | QFP | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, EQFP-144 | 144 | compliant | 8542.39.00.01 | ||||||||||||
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XC3S50A-4TQG144C
AMD Xilinx
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$3.4252 | Yes | Yes | Transferred | 1.2 V | 108 | 101 | 1584 | 50000 | 176 | 710 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 176 CLBS, 50000 GATES | 667 MHz | 1.26 V | 1.14 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 85 °C | 260 | 30 | 144 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | XILINX INC | QFP | TQFP-144 | 144 | compliant | EAR99 | 8542.39.00.01 | ||||||
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LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
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$3.5154 | Yes | Active | 2.5 V | 21 | 21 | 256 | 32 | FIELD PROGRAMMABLE GATE ARRAY | SQUARE | 32 CLBS | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 139 MHz | 3.465 V | 2.375 V | S-XQCC-N32 | Not Qualified | e3 | 3 | 100 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TRAY | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 600 µm | LATTICE SEMICONDUCTOR CORP | QFN-32 | compliant | EAR99 | 8542.39.00.01 | Lattice Semiconductor | |||||||||
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XC6SLX9-2TQG144C
AMD Xilinx
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$3.6915 | Yes | Yes | Transferred | 1.2 V | 102 | 102 | 9152 | 715 | 260 ps | FIELD PROGRAMMABLE GATE ARRAY | OTHER | SQUARE | CMOS | 715 CLBS | 667 MHz | 1.26 V | 1.14 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 85 °C | 260 | 30 | 144 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | XILINX INC | QFP | TQFP-144 | 144 | compliant | EAR99 | 8542.39.00.01 |