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Parametric results for: Other uPs/uCs/Peripheral ICs

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Sorted By: Supply Voltage-Nom
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XCVM1502-1LLIVSVA2197
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B2197 e1 110 °C -40 °C NOT SPECIFIED NOT SPECIFIED 2197 PLASTIC/EPOXY HBGA BGA2197,47X47,36 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 920 µm BOTTOM 4 mm 45 mm 45 mm XILINX INC FCBGA-2197 compliant
XCVC1702-2LLEVSVA1596
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV MICROPROCESSOR CIRCUIT CMOS 724 mV 676 mV S-PBGA-B1596 110 °C 1596 PLASTIC/EPOXY HBGA BGA1596,40X40,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 4 mm 37.5 mm 37.5 mm XILINX INC FCBGA-1596 compliant
XCVM1402-2LLENSVF1369
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B1369 110 °C 1369 PLASTIC/EPOXY HBGA BGA1369,37X37,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 4 mm 35 mm 35 mm XILINX INC FCBGA-1369 compliant
XCVM1402-1LLIVSVD1760
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B1760 e1 110 °C -40 °C 1760 PLASTIC/EPOXY HBGA BGA1760,42X42,36 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 920 µm BOTTOM 4 mm 40 mm 40 mm XILINX INC FCBGA-1760 compliant
XCVP1102-1LLIVSVA2785
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV MICROPROCESSOR CIRCUIT CMOS 724 mV 676 mV S-PBGA-B2785 110 °C -40 °C 2785 PLASTIC/EPOXY HBGA BGA2785,53X53,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 4.48 mm 50 mm 50 mm XILINX INC FCBGA-2785 compliant
XCVM1302-1LSINSVF1369
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B1369 110 °C -40 °C 1369 PLASTIC/EPOXY HBGA BGA1369,37X37,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 4 mm 35 mm 35 mm XILINX INC FCBGA-1369 compliant
XCVM1302-2LSENBVB1024
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B1024 110 °C 1024 PLASTIC/EPOXY HBGA BGA1024,32X32,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 2.94 mm 31 mm 31 mm XILINX INC FCBGA-1024 compliant
XCVE1752-2LLEVSVA2197
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B2197 e1 110 °C 2197 PLASTIC/EPOXY HBGA BGA2197,47X47,36 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 920 µm BOTTOM 4 mm 45 mm 45 mm XILINX INC FCBGA-2197 compliant
XCVC1902-2LLIVSVA2197
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B2197 e1 110 °C -40 °C 2197 PLASTIC/EPOXY HBGA BGA2197,47X47,36 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 920 µm BOTTOM 4 mm 45 mm 45 mm XILINX INC FCBGA-2197 compliant
XCVM1302-2LLEVSVD1760
 AMD Xilinx 		Check for Price Yes Transferred YES 700 mV SoC CMOS 724 mV 676 mV S-PBGA-B1760 110 °C 1760 PLASTIC/EPOXY HBGA BGA1760,42X42,36 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 920 µm BOTTOM 4 mm 40 mm 40 mm XILINX INC FCBGA-1760 compliant
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