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31 - 40 of 89,023 results
Select Parts | Part Number |
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EFM8BB50F16G-A-QFN12
Silicon Laboratories Inc
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EFM8BB50F16G-A-QFN16
Silicon Laboratories Inc
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EFM8BB50F16G-A-SOIC16
Silicon Laboratories Inc
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EFM8BB50F16I-A-QFN16
Silicon Laboratories Inc
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MTCH1030-I/MG
Microchip Technology Inc
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ECC204-RBVCZ-B
Microchip Technology Inc
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TEA1791AT/N1,118
NXP Semiconductors
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NT3H2211W0FHKH
NXP Semiconductors
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TDA8035HN/C1,157
NXP Semiconductors
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TIR1000IPWR
Texas Instruments
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Additional Feature
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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HTS Code
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Samacsys Manufacturer
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Part Package Code
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Pin Count
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Manufacturer Package Code
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ECCN Code
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Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N12 | 85 °C | -40 °C | 12 | UNSPECIFIED | HVQCCN | LCC12,.08SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 2 mm | 2 mm | SILICON LABORATORIES INC | QFN-12 | unknown | ||||||||||||||||
Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.098SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 800 µm | 2.5 mm | 2.5 mm | SILICON LABORATORIES INC | QFN-16 | unknown | ||||||||||||||||
Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 9.9 mm | SILICON LABORATORIES INC | SOIC-16 | unknown | ||||||||||||||||
Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N16 | 125 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.098SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 800 µm | 2.5 mm | 2.5 mm | SILICON LABORATORIES INC | QFN-16 | unknown | ||||||||||||||||
Yes | Active | YES | 3 V | CAPACITIVE TOUCH SCREEN CONTROLLER | CMOS | 5.5 V | 2 V | S-PQCC-N16 | e3 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | QFN-16 | unknown | 8542.31.00.01 | Microchip | ||||||||||||
Active | YES | CRYPTOGRAPHIC AUTHENTICATOR | CMOS | 5.5 V | 1.65 V | R-XXSS-N3 | 105 °C | -40 °C | 3 | UNSPECIFIED | XSS | RECTANGULAR | SPECIAL SHAPE | NO LEAD | 2 mm | UNSPECIFIED | 550 µm | 2.5 mm | 6.5 mm | MICROCHIP TECHNOLOGY INC | PACKAGE-3 | unknown | |||||||||||||||||||
Yes | Active | NXP SEMICONDUCTORS | compliant | NXP | SOIC | 8 | SOT96-1 | ||||||||||||||||||||||||||||||||||
Yes | Active | YES | 1.8 V | NFC CONTROLLER | CMOS | 3.6 V | 1.67 V | S-PQCC-N8 | e4 | 1 | 105 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVQCCN | LCC8,.07SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 500 µm | 1.6 mm | 1.6 mm | NXP SEMICONDUCTORS | XQFN-8 | compliant | NXP | QFN | 8 | SOT902-3 | |||||||
Yes | Active | NXP SEMICONDUCTORS | HVQFN-32 | compliant | NXP | QFN | 32 | SOT617-7 | |||||||||||||||||||||||||||||||||
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3.3 V | 2.7 V | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 3 mm | 4.4 mm | TEXAS INSTRUMENTS INC | GREEN, PLASTIC, TSSOP-8 | compliant | 8542.39.00.01 | Texas Instruments | SOIC | 8 | EAR99 |
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EFM8BB50F16G-A-QFN12
Silicon Laboratories Inc
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$0.8371 | Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N12 | 85 °C | -40 °C | 12 | UNSPECIFIED | HVQCCN | LCC12,.08SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 2 mm | 2 mm | SILICON LABORATORIES INC | QFN-12 | unknown | |||||||||||||||||
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EFM8BB50F16G-A-QFN16
Silicon Laboratories Inc
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$0.8582 | Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.098SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 800 µm | 2.5 mm | 2.5 mm | SILICON LABORATORIES INC | QFN-16 | unknown | |||||||||||||||||
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EFM8BB50F16G-A-SOIC16
Silicon Laboratories Inc
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$0.8605 | Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 9.9 mm | SILICON LABORATORIES INC | SOIC-16 | unknown | |||||||||||||||||
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EFM8BB50F16I-A-QFN16
Silicon Laboratories Inc
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$0.8975 | Yes | Active | YES | 3.3 V | SoC | CMOS | 5.5 V | 1.8 V | S-XQCC-N16 | 125 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.098SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 800 µm | 2.5 mm | 2.5 mm | SILICON LABORATORIES INC | QFN-16 | unknown | |||||||||||||||||
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MTCH1030-I/MG
Microchip Technology Inc
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$0.9000 | Yes | Active | YES | 3 V | CAPACITIVE TOUCH SCREEN CONTROLLER | CMOS | 5.5 V | 2 V | S-PQCC-N16 | e3 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | QFN-16 | unknown | 8542.31.00.01 | Microchip | |||||||||||||
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ECC204-RBVCZ-B
Microchip Technology Inc
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$0.9000 | Active | YES | CRYPTOGRAPHIC AUTHENTICATOR | CMOS | 5.5 V | 1.65 V | R-XXSS-N3 | 105 °C | -40 °C | 3 | UNSPECIFIED | XSS | RECTANGULAR | SPECIAL SHAPE | NO LEAD | 2 mm | UNSPECIFIED | 550 µm | 2.5 mm | 6.5 mm | MICROCHIP TECHNOLOGY INC | PACKAGE-3 | unknown | ||||||||||||||||||||
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TEA1791AT/N1,118
NXP Semiconductors
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$0.9056 | Yes | Active | NXP SEMICONDUCTORS | compliant | NXP | SOIC | 8 | SOT96-1 | |||||||||||||||||||||||||||||||||||
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NT3H2211W0FHKH
NXP Semiconductors
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$0.9091 | Yes | Active | YES | 1.8 V | NFC CONTROLLER | CMOS | 3.6 V | 1.67 V | S-PQCC-N8 | e4 | 1 | 105 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVQCCN | LCC8,.07SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 500 µm | 1.6 mm | 1.6 mm | NXP SEMICONDUCTORS | XQFN-8 | compliant | NXP | QFN | 8 | SOT902-3 | ||||||||
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TDA8035HN/C1,157
NXP Semiconductors
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$0.9265 | Yes | Active | NXP SEMICONDUCTORS | HVQFN-32 | compliant | NXP | QFN | 32 | SOT617-7 | ||||||||||||||||||||||||||||||||||
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TIR1000IPWR
Texas Instruments
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$0.9265 | Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3.3 V | 2.7 V | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 3 mm | 4.4 mm | TEXAS INSTRUMENTS INC | GREEN, PLASTIC, TSSOP-8 | compliant | 8542.39.00.01 | Texas Instruments | SOIC | 8 | EAR99 |