Parametric results for: P2010NSE2HFC under Microprocessors

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MCF5274VM166
NXP Semiconductors
$1.0000 Yes Not Recommended 32 166 MHz 32 24 83 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS ALSO REQUIRES 3.3V SUPPLY YES FIXED POINT YES YES 1.6 V 1.4 V COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS ROHS COMPLIANT, PLASTIC, MAPBGA-256 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306SVMADDCA
NXP Semiconductors
$1.0000 Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
SAM9X60D5MT-I/4FB
Microchip Technology Inc
$1.0000 Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 512-Mbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B233 e1 3 85 °C -40 °C 260 30 233 PLASTIC/EPOXY TFBGA BGA233,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-233 compliant 5A992.C 8542.31.00.01 Microchip 2019-09-23
MIMXRT555SFFOCR
NXP Semiconductors
$1.0000 Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
SAM9X75-I/4PB
Microchip Technology Inc
$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 15 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
DS28S60Q+
Maxim Integrated Products
$1.7762 Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TDFN-12 compliant 8542.31.00.01 2020-06-18
MC9S08PT8VLD
NXP Semiconductors
$1.8750 Yes Not Recommended 8 20 MHz 8192 2048 HCS08 YES MICROPROCESSOR, RISC CMOS FLASH 14 mA INDUSTRIAL S-PQFP-G44 Not Qualified e3 3 105 °C -40 °C 260 40 44 PLASTIC/EPOXY QFP QFP44,.47SQ,32 SQUARE FLATPACK Tin (Sn) GULL WING 800 µm QUAD NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
EFR32FG22C121F512GM40-C
Silicon Laboratories Inc
$1.9850 Yes Active MICROPROCESSOR, RISC e3 2 260 40 Matte Tin (Sn) SILICON LABORATORIES INC unknown 8542.31.00.01
MC9S08PT16VTJ
NXP Semiconductors
$2.0200 Yes Not Recommended 8 20 MHz 16384 2048 HCS08 20 MHz YES 5 V MICROPROCESSOR, RISC CMOS NO FIXED POINT NO YES FLASH 14 mA 5.5 V 2.7 V INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 105 °C -40 °C 260 40 20 PLASTIC/EPOXY SOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE Tin (Sn) GULL WING 635 µm DUAL NXP SEMICONDUCTORS TSSOP-20 compliant 3A991.A.2 8542.31.00.01 NXP
MC9S08PT16VWJ
NXP Semiconductors
$2.1086 Yes Not Recommended 8 20 MHz 16384 2048 HCS08 20 MHz YES 5 V MICROPROCESSOR, RISC CMOS NO FIXED POINT NO YES FLASH 14 mA 5.5 V 2.7 V INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 105 °C -40 °C 260 40 20 PLASTIC/EPOXY SOP SOP20,.4 RECTANGULAR SMALL OUTLINE Tin (Sn) GULL WING 1.27 mm DUAL NXP SEMICONDUCTORS SOIC-20 compliant 3A991.A.2 8542.31.00.01 NXP