Parametric results for: uPD8080AFC-1 under Microprocessors

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SAM9X70T-I/4PB
Microchip Technology Inc
$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 13 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC compliant 5A992.C 8542.31.00.01 Microchip TFBGA-361 2018-12-14
MIMXRT555SFFOCR
NXP Semiconductors
$1.0000 Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
MCF5274VM166
NXP Semiconductors
$1.0000 Yes Not Recommended 32 166 MHz 32 24 83 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS ALSO REQUIRES 3.3V SUPPLY YES FIXED POINT YES YES 1.6 V 1.4 V COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 ROHS COMPLIANT, PLASTIC, MAPBGA-256
SAM9X60D5MT-I/4FB
Microchip Technology Inc
$1.0000 Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 512-Mbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B233 e1 3 85 °C -40 °C 260 30 233 PLASTIC/EPOXY TFBGA BGA233,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC compliant 5A992.C 8542.31.00.01 Microchip TFBGA-233 2019-09-23
SAM9X75-I/4PB
Microchip Technology Inc
$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 15 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
AT91SAM9G20B-CU-999
Microchip Technology Inc
$1.1775 Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC compliant 3A991.A.2 8542.31.00.01 Microchip LFBGA, BGA217,17X17,32
DS28S60Q+
Maxim Integrated Products
$1.7474 Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC compliant 8542.31.00.01 TDFN-12 2020-06-18
MC9S08PT8VLD
NXP Semiconductors
$1.8750 Yes Not Recommended 8 20 MHz 8192 2048 HCS08 YES MICROPROCESSOR, RISC CMOS FLASH 14 mA INDUSTRIAL S-PQFP-G44 Not Qualified e3 3 105 °C -40 °C 260 40 44 PLASTIC/EPOXY QFP QFP44,.47SQ,32 SQUARE FLATPACK Tin (Sn) GULL WING 800 µm QUAD NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01
EFR32FG22C121F512GM40-C
Silicon Laboratories Inc
$1.9850 Yes Active MICROPROCESSOR, RISC e3 2 260 40 Matte Tin (Sn) SILICON LABORATORIES INC unknown 8542.31.00.01