Parametric results for: MC68030. under Microprocessors

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Select parts from the table below to compare.
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Select Parts Part Number
ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
MCIMX6S5EVM10AB
NXP Semiconductors
MIMXRT555SFFOCR
NXP Semiconductors
MCF5484CZP200
NXP Semiconductors
SAM9X75-I/4PB
Microchip Technology Inc
AT91SAM9G20B-CU-999
Microchip Technology Inc
MIMXRT1011CAE4A
NXP Semiconductors
DS28S60Q+
Maxim Integrated Products
MC9S08PT8VLD
NXP Semiconductors
MC9S08PT16VTJ
NXP Semiconductors
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Rohs Code
Part Life Cycle Code
Bit Size Speed ROM (words) RAM (bytes) RAM (words) CPU Family
External Data Bus Width
Address Bus Width Clock Frequency-Max
Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Boundary Scan
Format
Integrated Cache
Low Power Mode
Number of DMA Channels Number of External Interrupts Number of Serial I/Os On Chip Data RAM Width
ROM Programmability
Supply Current-Max
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Package Description
Reach Compliance Code
ECCN Code
HTS Code
Date Of Intro
Samacsys Manufacturer
Yes Active MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 2018-12-14 Microchip
Yes Not Recommended YES SoC CMOS 1.5 V 1.35 V OTHER S-PBGA-B624 e1 3 105 °C -20 °C 260 40 624 PLASTIC/EPOXY LFBGA BGA624,25X25,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 21 mm 21 mm NXP SEMICONDUCTORS MABGA-624 compliant 5A992.C 8542.31.00.01 NXP
Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
No Not Recommended 32 200 MHz 66.67 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.6 V 3 V INDUSTRIAL S-PBGA-B388 Not Qualified e0 3 85 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 unknown 3A991.A.2 8542.31.00.01 NXP
Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 15 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
Yes Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA-217 compliant 3A991.A.2 8542.31.00.01 Microchip
Yes Active MICROPROCESSOR, RISC e3 3 260 40 Tin (Sn) NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 2019-10-30 NXP
Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TDFN-12 compliant 8542.31.00.01 2020-06-18
Yes Not Recommended 8 20 MHz 8192 2048 HCS08 YES MICROPROCESSOR, RISC CMOS FLASH 14 mA INDUSTRIAL S-PQFP-G44 Not Qualified e3 3 105 °C -40 °C 260 40 44 PLASTIC/EPOXY QFP QFP44,.47SQ,32 SQUARE FLATPACK Tin (Sn) GULL WING 800 µm QUAD NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
Yes Not Recommended 8 20 MHz 16384 2048 HCS08 20 MHz YES 5 V MICROPROCESSOR, RISC CMOS NO FIXED POINT NO YES FLASH 14 mA 5.5 V 2.7 V INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 105 °C -40 °C 260 40 20 PLASTIC/EPOXY SOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE Tin (Sn) GULL WING 635 µm DUAL NXP SEMICONDUCTORS TSSOP-20 compliant 3A991.A.2 8542.31.00.01 NXP
Compare
ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
$1.0000 Buy Yes Active MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 2018-12-14 Microchip
MCIMX6S5EVM10AB
NXP Semiconductors
$1.0000 Buy Yes Not Recommended YES SoC CMOS 1.5 V 1.35 V OTHER S-PBGA-B624 e1 3 105 °C -20 °C 260 40 624 PLASTIC/EPOXY LFBGA BGA624,25X25,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 21 mm 21 mm NXP SEMICONDUCTORS MABGA-624 compliant 5A992.C 8542.31.00.01 NXP
MIMXRT555SFFOCR
NXP Semiconductors
$1.0000 Buy Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
MCF5484CZP200
NXP Semiconductors
$1.0000 Buy No Not Recommended 32 200 MHz 66.67 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.6 V 3 V INDUSTRIAL S-PBGA-B388 Not Qualified e0 3 85 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 unknown 3A991.A.2 8542.31.00.01 NXP
SAM9X75-I/4PB
Microchip Technology Inc
$1.0000 Buy Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 15 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
AT91SAM9G20B-CU-999
Microchip Technology Inc
$1.3123 Buy Yes Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA-217 compliant 3A991.A.2 8542.31.00.01 Microchip
MIMXRT1011CAE4A
NXP Semiconductors
$1.3424 Buy Yes Active MICROPROCESSOR, RISC e3 3 260 40 Tin (Sn) NXP SEMICONDUCTORS compliant 5A992.C 8542.31.00.01 2019-10-30 NXP
DS28S60Q+
Maxim Integrated Products
$1.7762 Buy Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TDFN-12 compliant 8542.31.00.01 2020-06-18
MC9S08PT8VLD
NXP Semiconductors
$1.8750 Buy Yes Not Recommended 8 20 MHz 8192 2048 HCS08 YES MICROPROCESSOR, RISC CMOS FLASH 14 mA INDUSTRIAL S-PQFP-G44 Not Qualified e3 3 105 °C -40 °C 260 40 44 PLASTIC/EPOXY QFP QFP44,.47SQ,32 SQUARE FLATPACK Tin (Sn) GULL WING 800 µm QUAD NXP SEMICONDUCTORS compliant 3A991.A.2 8542.31.00.01 NXP
MC9S08PT16VTJ
NXP Semiconductors
$2.0200 Buy Yes Not Recommended 8 20 MHz 16384 2048 HCS08 20 MHz YES 5 V MICROPROCESSOR, RISC CMOS NO FIXED POINT NO YES FLASH 14 mA 5.5 V 2.7 V INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 105 °C -40 °C 260 40 20 PLASTIC/EPOXY SOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE Tin (Sn) GULL WING 635 µm DUAL NXP SEMICONDUCTORS TSSOP-20 compliant 3A991.A.2 8542.31.00.01 NXP