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21 - 30 of 82,221 results
Select Parts | Part Number |
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ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
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MCIMX6S5EVM10AB
NXP Semiconductors
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MIMXRT555SFFOCR
NXP Semiconductors
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MCF5484CZP200
NXP Semiconductors
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SAM9X75-I/4PB
Microchip Technology Inc
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AT91SAM9G20B-CU-999
Microchip Technology Inc
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MIMXRT1011CAE4A
NXP Semiconductors
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DS28S60Q+
Maxim Integrated Products
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MC9S08PT8VLD
NXP Semiconductors
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MC9S08PT16VTJ
NXP Semiconductors
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Bit Size | Speed | ROM (words) | RAM (bytes) | RAM (words) |
CPU Family
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External Data Bus Width
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Address Bus Width |
Clock Frequency-Max
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Boundary Scan
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Format
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Integrated Cache
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Low Power Mode
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Number of DMA Channels | Number of External Interrupts | Number of Serial I/Os |
On Chip Data RAM Width
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ROM Programmability
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Supply Current-Max
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Date Of Intro
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Samacsys Manufacturer
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Yes | Active | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | 2018-12-14 | Microchip | |||||||||||||||||||||||||||||||||||||||||||||||||
Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MABGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||||||||||||
Yes | Active | MICROPROCESSOR, RISC | 3 | 260 | 40 | NXP SEMICONDUCTORS | compliant | NXP | |||||||||||||||||||||||||||||||||||||||||||||||||
No | Not Recommended | 32 | 200 MHz | 66.67 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 3.6 V | 3 V | INDUSTRIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||
Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 15 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||||||||||||||
Yes | Active | 32 | 400 MHz | 32768 | 32 | 26 | 50 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 24 | 3 | 1 | 8 | 1.1 V | 900 mV | INDUSTRIAL | S-PBGA-B217 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 217 | PLASTIC/EPOXY | LFBGA | BGA217,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-217 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||
Yes | Active | MICROPROCESSOR, RISC | e3 | 3 | 260 | 40 | Tin (Sn) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | 2019-10-30 | NXP | ||||||||||||||||||||||||||||||||||||||||||||
Yes | Transferred | YES | 3.3 V | CRYPTOGRAPHIC AUTHENTICATOR | CMOS | 3.63 V | 1.62 V | INDUSTRIAL | S-PDSO-N12 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVSON | SOLCC12,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TDFN-12 | compliant | 8542.31.00.01 | 2020-06-18 | ||||||||||||||||||||||||
Yes | Not Recommended | 8 | 20 MHz | 8192 | 2048 | HCS08 | YES | MICROPROCESSOR, RISC | CMOS | FLASH | 14 mA | INDUSTRIAL | S-PQFP-G44 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 44 | PLASTIC/EPOXY | QFP | QFP44,.47SQ,32 | SQUARE | FLATPACK | Tin (Sn) | GULL WING | 800 µm | QUAD | NXP SEMICONDUCTORS | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||||||||
Yes | Not Recommended | 8 | 20 MHz | 16384 | 2048 | HCS08 | 20 MHz | YES | 5 V | MICROPROCESSOR, RISC | CMOS | NO | FIXED POINT | NO | YES | FLASH | 14 mA | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 20 | PLASTIC/EPOXY | SOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE | Tin (Sn) | GULL WING | 635 µm | DUAL | NXP SEMICONDUCTORS | TSSOP-20 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |
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ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
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$1.0000 Buy | Yes | Active | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | 2018-12-14 | Microchip | ||||||||||||||||||||||||||||||||||||||||||||||||||
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MCIMX6S5EVM10AB
NXP Semiconductors
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$1.0000 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MABGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||||||||||||||
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MIMXRT555SFFOCR
NXP Semiconductors
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$1.0000 Buy | Yes | Active | MICROPROCESSOR, RISC | 3 | 260 | 40 | NXP SEMICONDUCTORS | compliant | NXP | ||||||||||||||||||||||||||||||||||||||||||||||||||
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MCF5484CZP200
NXP Semiconductors
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$1.0000 Buy | No | Not Recommended | 32 | 200 MHz | 66.67 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 3.6 V | 3 V | INDUSTRIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||||||
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SAM9X75-I/4PB
Microchip Technology Inc
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$1.0000 Buy | Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 15 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||||||||||||
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AT91SAM9G20B-CU-999
Microchip Technology Inc
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$1.3123 Buy | Yes | Active | 32 | 400 MHz | 32768 | 32 | 26 | 50 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 24 | 3 | 1 | 8 | 1.1 V | 900 mV | INDUSTRIAL | S-PBGA-B217 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 217 | PLASTIC/EPOXY | LFBGA | BGA217,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-217 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||||||
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MIMXRT1011CAE4A
NXP Semiconductors
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$1.3424 Buy | Yes | Active | MICROPROCESSOR, RISC | e3 | 3 | 260 | 40 | Tin (Sn) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | 2019-10-30 | NXP | |||||||||||||||||||||||||||||||||||||||||||||
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DS28S60Q+
Maxim Integrated Products
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$1.7762 Buy | Yes | Transferred | YES | 3.3 V | CRYPTOGRAPHIC AUTHENTICATOR | CMOS | 3.63 V | 1.62 V | INDUSTRIAL | S-PDSO-N12 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVSON | SOLCC12,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TDFN-12 | compliant | 8542.31.00.01 | 2020-06-18 | |||||||||||||||||||||||||
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MC9S08PT8VLD
NXP Semiconductors
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$1.8750 Buy | Yes | Not Recommended | 8 | 20 MHz | 8192 | 2048 | HCS08 | YES | MICROPROCESSOR, RISC | CMOS | FLASH | 14 mA | INDUSTRIAL | S-PQFP-G44 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 44 | PLASTIC/EPOXY | QFP | QFP44,.47SQ,32 | SQUARE | FLATPACK | Tin (Sn) | GULL WING | 800 µm | QUAD | NXP SEMICONDUCTORS | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||||||||||||
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MC9S08PT16VTJ
NXP Semiconductors
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$2.0200 Buy | Yes | Not Recommended | 8 | 20 MHz | 16384 | 2048 | HCS08 | 20 MHz | YES | 5 V | MICROPROCESSOR, RISC | CMOS | NO | FIXED POINT | NO | YES | FLASH | 14 mA | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 20 | PLASTIC/EPOXY | SOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE | Tin (Sn) | GULL WING | 635 µm | DUAL | NXP SEMICONDUCTORS | TSSOP-20 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |