Parametric results for: MPC7455RXPXPNS under Microprocessors

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ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 65536 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 16 1.9 V 1.7 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C 289 PLASTIC/EPOXY TFBGA BGA289,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-289 compliant 5A992.C 8542.31.00.01 2017-09-07 Microchip
ATSAMA5D35A-CNR
Microchip Technology Inc
$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 105 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA324,18X18,32 compliant 5A992.C 8542.31.00.01 Microchip
ATSAMA5D42B-CUR
Microchip Technology Inc
$1.0000 Active 32 600 MHz 131072 32 26 50 MHz YES 1.26 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 32 1 2 8 1.32 V 1.16 V INDUSTRIAL S-PBGA-B361 e1 1 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER OVER NICKEL BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 2017-10-26 Microchip
MPC8308CVMAFDA
NXP Semiconductors
$1.0000 Yes Obsolete 32 333 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 4 1.05 V 950 mV INDUSTRIAL S-PBGA-B473 Not Qualified e2 3 105 °C -40 °C 260 40 473 PLASTIC/EPOXY LFBGA BGA473,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.54 mm 19 mm 19 mm NXP SEMICONDUCTORS LFBGA, BGA473,23X23,32 compliant 3A991.A.2 8542.31.00.01 NXP
ATSAMA5D27C-CUR
Microchip Technology Inc
$1.0000 Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 2017-05-22 Microchip
ATSAMA5D33A-CUR
Microchip Technology Inc
$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 85 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA324,18X18,32 compliant 5A992.C 8542.31.00.01 Microchip
ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 65536 24 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 16 1.3 V 1.14 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C 289 PLASTIC/EPOXY TFBGA BGA289,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-289 compliant 5A992.C 8542.31.00.01 2017-07-24 Microchip
MPC5200CVR400B
NXP Semiconductors
$1.0000 Yes Not Recommended 400 MHz 32 13 35 MHz YES 1.5 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.58 V 1.42 V INDUSTRIAL S-PBGA-B272 e1 3 85 °C -40 °C 260 40 272 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-272 compliant 3A991.A.2 8542.31.00.01 NXP
ATSAMA5D27C-LD2G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 2018-12-14 Microchip
MPC8314CVRAFDA
NXP Semiconductors
$1.0000 Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 compliant 3A991.A.2 8542.31.00.01 NXP