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ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 65536 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 16 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | 289 | PLASTIC/EPOXY | TFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | 2017-09-07 | Microchip | |||||||||||||||
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ATSAMA5D35A-CNR
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||
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ATSAMA5D42B-CUR
Microchip Technology Inc
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$1.0000 | Active | 32 | 600 MHz | 131072 | 32 | 26 | 50 MHz | YES | 1.26 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 2 | 8 | 1.32 V | 1.16 V | INDUSTRIAL | S-PBGA-B361 | e1 | 1 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | 2017-10-26 | Microchip | ||||||
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MPC8308CVMAFDA
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 32 | 333 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 4 | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B473 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | NXP SEMICONDUCTORS | LFBGA, BGA473,23X23,32 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||
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ATSAMA5D27C-CUR
Microchip Technology Inc
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$1.0000 | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | 2017-05-22 | Microchip | ||||||||||
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ATSAMA5D33A-CUR
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||
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ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 65536 | 24 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 16 | 1.3 V | 1.14 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | 289 | PLASTIC/EPOXY | TFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | 2017-07-24 | Microchip | |||||||||||||||
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MPC5200CVR400B
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | 400 MHz | 32 | 13 | 35 MHz | YES | 1.5 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.58 V | 1.42 V | INDUSTRIAL | S-PBGA-B272 | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 272 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEBGA-272 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||
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ATSAMA5D27C-LD2G-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 32768 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 32 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B361 | 85 °C | -40 °C | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | 2018-12-14 | Microchip | |||||||||||||||
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MPC8314CVRAFDA
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | 32 | 333 MHz | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 620 | PLASTIC/EPOXY | HBGA | BGA620,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |