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Parametric results for: cfa11 under Microprocessors

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Select parts from the table below to compare.
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Select Parts Part Number
MPC8314CVRAFDA
 NXP Semiconductors
ATSAMA5D31A-CFUR
 Microchip Technology Inc
ATSAMA5D27C-LD2G-CUR
 Microchip Technology Inc
ATSAMA5D27C-LD1G-CUR
 Microchip Technology Inc
MPC8306SVMADDCA
 NXP Semiconductors
MIMXRT555SFFOCR
 NXP Semiconductors
MCF5484CZP200
 NXP Semiconductors
SAM9X75-I/4PB
 Microchip Technology Inc
AT91SAM9G20B-CU-999
 Microchip Technology Inc
DS28S60Q+
 Maxim Integrated Products
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Bit Size
Speed
RAM (words)
External Data Bus Width
Address Bus Width
Clock Frequency-Max
Surface Mount
Supply Voltage-Nom
uPs/uCs/Peripheral ICs Type
Technology
Boundary Scan
Format
Integrated Cache
Low Power Mode
Number of DMA Channels
Number of External Interrupts
Number of Serial I/Os
On Chip Data RAM Width
Supply Current-Max
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Package Description
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Date Of Intro
$1.0000
Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 compliant 3A991.A.2 8542.31.00.01 NXP
$1.0000
Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY TFBGA BGA324,22X22,20 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1.2 mm 12 mm 12 mm MICROCHIP TECHNOLOGY INC TFBGA-324 compliant 5A992.C 8542.31.00.01 Microchip
$1.0000
Yes Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 e1 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 Microchip 2018-12-14
$1.0000
Yes Active MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 Microchip 2018-12-14
$1.0000
Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
$1.0000
Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
$1.0000
No Not Recommended 32 200 MHz 66.67 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.6 V 3 V INDUSTRIAL S-PBGA-B388 Not Qualified e0 3 85 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 unknown 3A991.A.2 8542.31.00.01 NXP
$1.0000
Active 32 800 MHz 69632 16 23 50 MHz YES 1.15 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 16 8 3 mA 1.21 V 1.12 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.217 mm 11 mm 11 mm MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
$1.3123
Yes Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA-217 compliant 3A991.A.2 8542.31.00.01 Microchip
$1.7762
Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TDFN-12 compliant 8542.31.00.01 2020-06-18
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Compare
MPC8314CVRAFDA
 NXP Semiconductors 		$1.0000 Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 compliant 3A991.A.2 8542.31.00.01 NXP
ATSAMA5D31A-CFUR
 Microchip Technology Inc 		$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY TFBGA BGA324,22X22,20 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1.2 mm 12 mm 12 mm MICROCHIP TECHNOLOGY INC TFBGA-324 compliant 5A992.C 8542.31.00.01 Microchip
ATSAMA5D27C-LD2G-CUR
 Microchip Technology Inc 		$1.0000 Yes Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 e1 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 Microchip 2018-12-14
ATSAMA5D27C-LD1G-CUR
 Microchip Technology Inc 		$1.0000 Yes Active MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 Microchip 2018-12-14
MPC8306SVMADDCA
 NXP Semiconductors 		$1.0000 Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MIMXRT555SFFOCR
 NXP Semiconductors 		$1.0000 Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
MCF5484CZP200
 NXP Semiconductors 		$1.0000 No Not Recommended 32 200 MHz 66.67 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.6 V 3 V INDUSTRIAL S-PBGA-B388 Not Qualified e0 3 85 °C -40 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 unknown 3A991.A.2 8542.31.00.01 NXP
SAM9X75-I/4PB
 Microchip Technology Inc 		$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES 1.15 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 16 8 3 mA 1.21 V 1.12 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.217 mm 11 mm 11 mm MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
AT91SAM9G20B-CU-999
 Microchip Technology Inc 		$1.3123 Yes Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA-217 compliant 3A991.A.2 8542.31.00.01 Microchip
DS28S60Q+
 Maxim Integrated Products 		$1.7762 Yes Transferred YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 3.63 V 1.62 V INDUSTRIAL S-PDSO-N12 e3 1 105 °C -40 °C 260 30 12 PLASTIC/EPOXY HVSON SOLCC12,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm MAXIM INTEGRATED PRODUCTS INC TDFN-12 compliant 8542.31.00.01 2020-06-18
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