Parametric results for: BK80+1.1/4 under Microprocessors

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ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 65536 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 16 1.9 V 1.7 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C 289 PLASTIC/EPOXY TFBGA BGA289,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-289 compliant 5A992.C 8542.31.00.01 2017-09-07 Microchip
MPC8270VRMIBA
NXP Semiconductors
$1.0000 Yes Not Recommended 32 66.67 MHz 64 32 266 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.6 V 1.45 V COMMERCIAL S-PBGA-B516 Not Qualified e2 3 70 °C 245 30 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516 compliant 3A991.A.2 8542.31.00.01 NXP
ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 65536 24 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 16 1.3 V 1.14 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C 289 PLASTIC/EPOXY TFBGA BGA289,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-289 compliant 5A992.C 8542.31.00.01 2017-07-24 Microchip
ATSAMA5D27C-CUR
Microchip Technology Inc
$1.0000 Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 2017-05-22 Microchip
ATSAMA5D33A-CUR
Microchip Technology Inc
$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 85 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA324,18X18,32 compliant 5A992.C 8542.31.00.01 Microchip
MPC8314CVRAFDA
NXP Semiconductors
$1.0000 Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 compliant 3A991.A.2 8542.31.00.01 NXP
SAM9X60D6KT-I/4GB
Microchip Technology Inc
$1.0000 Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 64-Mbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B196 e1 3 85 °C -40 °C 260 30 196 PLASTIC/EPOXY TFBGA BGA196,16X16,25 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.2 mm 11 mm 11 mm MICROCHIP TECHNOLOGY INC TFBGA-196 compliant 5A992.C 8542.31.00.01 2019-09-23 Microchip
MCF5471ZP200
NXP Semiconductors
$1.0000 No Not Recommended 32 200 MHz 32 32 66.66 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.58 V 1.43 V COMMERCIAL S-PBGA-B388 Not Qualified e0 3 70 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, MS-034AAL-1, PBGA-388 unknown 5A002.A.1 8542.31.00.01
ATSAMA5D27C-LD2G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 2018-12-14 Microchip
MCIMX6S5EVM10AB
NXP Semiconductors
$1.0000 Yes Not Recommended YES SoC CMOS 1.5 V 1.35 V OTHER S-PBGA-B624 e1 3 105 °C -20 °C 260 40 624 PLASTIC/EPOXY LFBGA BGA624,25X25,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 21 mm 21 mm NXP SEMICONDUCTORS MABGA-624 compliant 5A992.C 8542.31.00.01 NXP