Parametric results for: AM3352BZCZA100 under Microprocessors

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MPC8314CVRAFDA
NXP Semiconductors
$1.0000 Yes Not Recommended 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B620 Not Qualified e2 3 105 °C -40 °C 260 40 620 PLASTIC/EPOXY HBGA BGA620,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.46 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 compliant 3A991.A.2 8542.31.00.01 NXP
MCF5471ZP200
NXP Semiconductors
$1.0000 No Not Recommended 32 200 MHz 32 32 66.66 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.58 V 1.43 V COMMERCIAL S-PBGA-B388 Not Qualified e0 3 70 °C 260 40 388 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, MS-034AAL-1, PBGA-388 unknown 5A002.A.1 8542.31.00.01 NXP
SAM9X60D6KT-I/4GB
Microchip Technology Inc
$1.0000 Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 64-Mbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B196 e1 3 85 °C -40 °C 260 30 196 PLASTIC/EPOXY TFBGA BGA196,16X16,25 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.2 mm 11 mm 11 mm MICROCHIP TECHNOLOGY INC TFBGA-196 compliant 5A992.C 8542.31.00.01 Microchip 2019-09-23
ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
$1.0000 Active 16 500 MHz 32768 24 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 51 1 32 1.9 V 1.7 V INDUSTRIAL S-PBGA-B361 85 °C -40 °C 361 PLASTIC/EPOXY TFBGA BGA361,19X19,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.2 mm 16 mm 16 mm MICROCHIP TECHNOLOGY INC TFBGA-361 compliant 5A992.C 8542.31.00.01 Microchip 2018-12-14
SPC5200CBV400B
NXP Semiconductors
$1.0000 No Not Recommended 32 400 MHz 32 32 66 MHz YES 1.5 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V SUPPLY YES FLOATING POINT YES YES 1.58 V 1.42 V INDUSTRIAL S-PBGA-B272 Not Qualified e0 3 85 °C -40 °C 245 AEC-Q100 30 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY Tin/Lead/Silver (Sn/Pb/Ag) BALL 1.27 mm BOTTOM 2.65 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 not_compliant 3A991.A.2 8542.31.00.01 NXP
SAM9X70T-I/4PB
Microchip Technology Inc
$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 13 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
MCIMX6S5EVM10AB
NXP Semiconductors
$1.0000 Yes Not Recommended YES SoC CMOS 1.5 V 1.35 V OTHER S-PBGA-B624 e1 3 105 °C -20 °C 260 40 624 PLASTIC/EPOXY LFBGA BGA624,25X25,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.6 mm 21 mm 21 mm NXP SEMICONDUCTORS MABGA-624 compliant 5A992.C 8542.31.00.01 NXP
MCF52277CVM160
NXP Semiconductors
$1.0000 Yes Not Recommended 32 166.67 MHz 32 24 66.67 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES NO 700 µA 1.6 V 1.4 V INDUSTRIAL S-PBGA-B196 Not Qualified e1 3 85 °C -40 °C 260 40 196 PLASTIC/EPOXY LFBGA BGA196,14X14,40 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.7 mm 15 mm 15 mm NXP SEMICONDUCTORS 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 compliant 3A991.A.2 8542.31.00.01
MIMXRT555SFFOCR
NXP Semiconductors
$1.0000 Yes Active MICROPROCESSOR, RISC 3 260 40 NXP SEMICONDUCTORS compliant NXP
MCF5274VM166
NXP Semiconductors
$1.0000 Yes Not Recommended 32 166 MHz 32 24 83 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS ALSO REQUIRES 3.3V SUPPLY YES FIXED POINT YES YES 1.6 V 1.4 V COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 40 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm NXP SEMICONDUCTORS ROHS COMPLIANT, PLASTIC, MAPBGA-256 compliant 3A991.A.2 8542.31.00.01 NXP