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MCF5485CZP200
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 200 MHz | 66.67 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 3.6 V | 3 V | INDUSTRIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 | unknown | 5A002.A.1 | 8542.31.00.01 | NXP | |||||||||||||
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ATSAMA5D35A-CNR
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||
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ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 65536 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 16 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | 289 | PLASTIC/EPOXY | TFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-09-07 | ||||||||||||||
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MPC8308CVMAFDA
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 32 | 333 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 4 | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B473 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | NXP SEMICONDUCTORS | LFBGA, BGA473,23X23,32 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||
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ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 65536 | 24 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 16 | 1.3 V | 1.14 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | 289 | PLASTIC/EPOXY | TFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-07-24 | ||||||||||||||
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ATSAMA5D27C-CUR
Microchip Technology Inc
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$1.0000 | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 | |||||||||
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ATSAMA5D33A-CUR
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||
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MCF5471ZP200
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 200 MHz | 32 | 32 | 66.66 MHz | YES | 1.5 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 1.58 V | 1.43 V | COMMERCIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 70 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, MS-034AAL-1, PBGA-388 | unknown | 5A002.A.1 | 8542.31.00.01 | |||||||||||||
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ATSAMA5D27C-LD2G-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 32768 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 32 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B361 | 85 °C | -40 °C | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2018-12-14 | ||||||||||||||
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MPC852TVR50A
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 32 | 50 MHz | 32 | 32 | 66 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | ALSO REQUIRES 3.3V SUPPLY | YES | FIXED POINT | YES | YES | 1.9 V | 1.7 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 245 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,50 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.54 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | PLASTIC, BGA-256 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |