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Select Parts | Part Number |
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FT232BL
FTDI Chip
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USB2512B-AEZG-TR
Microchip Technology Inc
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USB2250I-NU-06
Microchip Technology Inc
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USB3503T-I/ML
Microchip Technology Inc
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UTC2000-I/MG
Microchip Technology Inc
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USB3341-CP
Microchip Technology Inc
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UTC2000/MG
Microchip Technology Inc
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CYPD2103-20FNXIT
Infineon Technologies AG
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FUSB307BVMPX
onsemi
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CYPD2122-24LQXIT
Infineon Technologies AG
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Bus Compatibility |
External Data Bus Width
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Address Bus Width |
Data Transfer Rate-Max
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Clock Frequency-Max
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Supply Current-Max
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Part Package Code
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Pin Count
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Manufacturer Package Code
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Analog IC - Other Type
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Yes | Obsolete | 60 MBps | 6 MHz | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 5.25 V | 4.35 V | COMMERCIAL | S-PQFP-G32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 7 mm | 7 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | 7 X 7 MM, 0.80 MM PITCH, ROHS COMPLIANT, LQFP-32 | compliant | EAR99 | 8542.31.00.01 | FTDI Chip | ||||||||||||
Yes | Active | I2C, SMBUS, USB | 24 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 65 mA | 3.6 V | 3 V | OTHER | S-XQCC-N36 | e3 | 85 °C | 36 | UNSPECIFIED | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN-36 | compliant | EAR99 | 8542.31.00.01 | Microchip | |||||||||||||||
Yes | Active | I2C; USB | 8 | 17 | 35 MBps | 24 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 165 mA | 3.6 V | 3 V | COMMERCIAL | S-PQFP-G128 | Not Qualified | e3 | 3 | 70 °C | 260 | TS 16949 | 30 | 128 | PLASTIC/EPOXY | TFQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 400 µm | QUAD | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFQFP, QFP128,.64SQ,16 | compliant | EAR99 | 8542.31.00.01 | Microchip | |||||||
Yes | Active | I2C; USB | 0.125 MBps | 52 MHz | YES | 1.8 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 110 mA | 2 V | 1.6 V | INDUSTRIAL | S-XQCC-N32 | e3 | 3 | 85 °C | -40 °C | 260 | 32 | UNSPECIFIED | HVQCCN | LCC32,.20SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, SQFN-32 | compliant | EAR99 | 8542.31.00.01 | Microchip | QFN | 32 | |||||||||
Yes | Active | USB | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 1.35 mA | 5.5 V | 4.5 V | INDUSTRIAL | S-XQCC-N16 | e3 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | 8542.31.00.01 | Microchip | |||||||||||||||
Yes | Active | UART; USB | 26 MHz | YES | 1.8 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 52 mA | 2 V | 1.6 V | INDUSTRIAL | S-PQCC-N24 | Not Qualified | e3 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | HQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 4 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||||||||
Yes | Active | USB | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 1.35 mA | 5.5 V | 4.5 V | COMMERCIAL | S-XQCC-N16 | e3 | 70 °C | TS 16949 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | EAR99 | 8542.31.00.01 | Microchip | |||||||||||||||
Yes | Active | I2C, SPI, UART, USB | 0.125 MBps | 48 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 5.5 V | 2.7 V | R-PBGA-B20 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | VFBGA | BGA20,4X5,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 550 µm | 1.63 mm | 2.03 mm | INFINEON TECHNOLOGIES AG | CSP-20 | compliant | Infineon | ||||||||||||||
Yes | Active | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 5.5 V | 2.8 V | INDUSTRIAL | S-PQCC-N16 | e4 | 1 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ONSEMI | compliant | 8542.31.00.01 | onsemi | WQFN-16 | 510BS | |||||||||||||||
Yes | Active | e4 | 3 | Nickel/Palladium/Gold (Ni/Pd/Au) | INFINEON TECHNOLOGIES AG | QFN-24 | compliant | EAR99 | 8542.39.00.01 | Infineon | POWER SUPPLY SUPPORT CIRCUIT |
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FT232BL
FTDI Chip
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$0.4554 | Yes | Obsolete | 60 MBps | 6 MHz | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 5.25 V | 4.35 V | COMMERCIAL | S-PQFP-G32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 7 mm | 7 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | 7 X 7 MM, 0.80 MM PITCH, ROHS COMPLIANT, LQFP-32 | compliant | EAR99 | 8542.31.00.01 | FTDI Chip | |||||||||||||
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USB2512B-AEZG-TR
Microchip Technology Inc
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$0.6555 | Yes | Active | I2C, SMBUS, USB | 24 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 65 mA | 3.6 V | 3 V | OTHER | S-XQCC-N36 | e3 | 85 °C | 36 | UNSPECIFIED | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN-36 | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||||||||||
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USB2250I-NU-06
Microchip Technology Inc
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$1.0000 | Yes | Active | I2C; USB | 8 | 17 | 35 MBps | 24 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 165 mA | 3.6 V | 3 V | COMMERCIAL | S-PQFP-G128 | Not Qualified | e3 | 3 | 70 °C | 260 | TS 16949 | 30 | 128 | PLASTIC/EPOXY | TFQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 400 µm | QUAD | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFQFP, QFP128,.64SQ,16 | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||
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USB3503T-I/ML
Microchip Technology Inc
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$1.0000 | Yes | Active | I2C; USB | 0.125 MBps | 52 MHz | YES | 1.8 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 110 mA | 2 V | 1.6 V | INDUSTRIAL | S-XQCC-N32 | e3 | 3 | 85 °C | -40 °C | 260 | 32 | UNSPECIFIED | HVQCCN | LCC32,.20SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, SQFN-32 | compliant | EAR99 | 8542.31.00.01 | Microchip | QFN | 32 | ||||||||||
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UTC2000-I/MG
Microchip Technology Inc
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$1.0658 | Yes | Active | USB | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 1.35 mA | 5.5 V | 4.5 V | INDUSTRIAL | S-XQCC-N16 | e3 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | 8542.31.00.01 | Microchip | ||||||||||||||||
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USB3341-CP
Microchip Technology Inc
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$1.0686 | Yes | Active | UART; USB | 26 MHz | YES | 1.8 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 52 mA | 2 V | 1.6 V | INDUSTRIAL | S-PQCC-N24 | Not Qualified | e3 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | HQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 4 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.31.00.01 | Microchip | |||||||||||||||
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UTC2000/MG
Microchip Technology Inc
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$1.1256 | Yes | Active | USB | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 1.35 mA | 5.5 V | 4.5 V | COMMERCIAL | S-XQCC-N16 | e3 | 70 °C | TS 16949 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||||||||||
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CYPD2103-20FNXIT
Infineon Technologies AG
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$1.1372 | Yes | Active | I2C, SPI, UART, USB | 0.125 MBps | 48 MHz | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | 5.5 V | 2.7 V | R-PBGA-B20 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | VFBGA | BGA20,4X5,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 550 µm | 1.63 mm | 2.03 mm | INFINEON TECHNOLOGIES AG | CSP-20 | compliant | Infineon | |||||||||||||||
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FUSB307BVMPX
onsemi
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$1.1827 | Yes | Active | YES | 3.3 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 5.5 V | 2.8 V | INDUSTRIAL | S-PQCC-N16 | e4 | 1 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 800 µm | 3 mm | 3 mm | ONSEMI | compliant | 8542.31.00.01 | onsemi | WQFN-16 | 510BS | ||||||||||||||||
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CYPD2122-24LQXIT
Infineon Technologies AG
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$1.2216 | Yes | Active | e4 | 3 | Nickel/Palladium/Gold (Ni/Pd/Au) | INFINEON TECHNOLOGIES AG | QFN-24 | compliant | EAR99 | 8542.39.00.01 | Infineon | POWER SUPPLY SUPPORT CIRCUIT |