Parametric results for: OTP ROMs

Filter Your Search

1 - 10 of 39,010 results

|
-
-
-
-
-
-
-
-
-
-
-
Sorted By: Clock Frequency-Max (fCLK)
Select parts from the table below to compare.
Compare
Compare
JBP28L42MJ
Texas Instruments
$46.0720 Yes No Active 4.096 kbit 8 512X8 5 V 70 ns 25 MHz OTP ROM SEPARATE 1 512 512 words ASYNCHRONOUS PARALLEL 100 µA 5.25 V 4.75 V BIPOLAR MILITARY R-GDIP-T20 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 20 CERAMIC, GLASS-SEALED DIP DIP20,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 24.195 mm 7.62 mm TEXAS INSTRUMENTS INC DIP DIP, DIP20,.3 20 not_compliant 3A001.A.2.C 8542.39.00.01
JBP28S42MJ
Texas Instruments
$44.8741 Yes No Active 4.096 kbit 8 512X8 5 V 70 ns 25 MHz OTP ROM SEPARATE 1 512 512 words ASYNCHRONOUS PARALLEL 100 µA 5.25 V 4.75 V BIPOLAR MILITARY R-GDIP-T20 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 20 CERAMIC, GLASS-SEALED DIP DIP20,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 24.195 mm 7.62 mm TEXAS INSTRUMENTS INC DIP DIP, DIP20,.3 20 not_compliant EAR99 8542.32.00.71 Texas Instruments
XC17128D-DD8R
AMD Xilinx
Check for Price No Transferred 131.072 kbit 1 128KX1 5 V 12.5 MHz CONFIGURATION MEMORY COMMON 128000 131.072 k 3-STATE 50 µA 10 µA CMOS MILITARY R-XDIP-T8 Not Qualified 125 °C -55 °C 38535Q/M;38534H;883B 8 CERAMIC DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17128D-SO8I
AMD Xilinx
Check for Price No Obsolete 131.072 kbit 1 128KX1 5 V 12.5 MHz CONFIGURATION MEMORY COMMON 128000 131.072 k 3-STATE 50 µA 10 µA CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e0 3 85 °C -40 °C 225 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17128D-SO8C
AMD Xilinx
Check for Price No Obsolete 131.072 kbit 1 128KX1 5 V 12.5 MHz CONFIGURATION MEMORY COMMON 128000 131.072 k 3-STATE 50 µA 10 µA CMOS COMMERCIAL R-PDSO-G8 Not Qualified e0 3 70 °C 225 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17128D-DD8I
AMD Xilinx
Check for Price No Obsolete 131.072 kbit 1 128KX1 5 V 12.5 MHz CONFIGURATION MEMORY COMMON 128000 131.072 k 3-STATE 50 µA 10 µA CMOS INDUSTRIAL R-XDIP-T8 Not Qualified 85 °C -40 °C 8 CERAMIC DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL XILINX INC DIP, DIP8,.3 unknown EAR99 8542.32.00.71
XC17256D-DD8R
AMD Xilinx
Check for Price No Obsolete 262.144 kbit 1 256KX1 5 V 12 MHz CONFIGURATION MEMORY COMMON 256000 262.144 k 3-STATE 50 µA 10 µA CMOS MILITARY R-XDIP-T8 Not Qualified 125 °C -55 °C 38535Q/M;38534H;883B 8 CERAMIC DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17256D-SO8C
AMD Xilinx
Check for Price No Obsolete 262.144 kbit 1 256KX1 5 V 12 MHz CONFIGURATION MEMORY COMMON 256000 262.144 k 3-STATE 50 µA 10 µA CMOS COMMERCIAL R-PDSO-G8 Not Qualified e0 3 70 °C 225 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17256D-SO8I
AMD Xilinx
Check for Price No Obsolete 262.144 kbit 1 256KX1 5 V 12 MHz CONFIGURATION MEMORY COMMON 256000 262.144 k 3-STATE 50 µA 10 µA CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e0 3 85 °C -40 °C 225 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL XILINX INC not_compliant EAR99 8542.32.00.71
XC17256D-DD8I
AMD Xilinx
Check for Price No Obsolete 262.144 kbit 1 256KX1 5 V 12 MHz CONFIGURATION MEMORY COMMON 256000 262.144 k 3-STATE 50 µA 10 µA CMOS INDUSTRIAL R-XDIP-T8 Not Qualified 85 °C -40 °C 8 CERAMIC DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL XILINX INC DIP, DIP8,.3 unknown EAR99 8542.32.00.71