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Parametric results for: hn62302btt-17 under MASK ROMs

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LH23512D-20
 Sharp Corp 		Check for Price No Obsolete 524.288 kbit 8 64KX8 5 V 200 ns MASK ROM 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 5.5 V 4.5 V NMOS COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE DUAL SHARP CORP 0.600 INCH, PLASTIC, DIP-28 unknown
HY23W08000D-120
 MagnaChip Semiconductor Ltd 		Check for Price Contact Manufacturer 4.1943 Mbit 8 512KX8 3.3 V 150 ns MASK ROM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 50 µA 60 µA CMOS COMMERCIAL R-PDIP-T32 Not Qualified 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL MAGNACHIP SEMICONDUCTOR LTD unknown EAR99 8542.32.00.71
HB1831C-Y-000
 Hughes Aircraft 		Check for Price Obsolete 524.288 kbit 8 64KX8 5 V 140 ns MASK ROM 1 512 512 words SYNCHRONOUS SERIAL 14 µA CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C 24 CERAMIC, GLASS-SEALED RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL HUGHES AIRCRAFT , unknown EAR99 8542.32.00.71
MX23L1010MI-20
 Macronix International Co Ltd 		Check for Price No Obsolete 1.0486 Mbit 8 128KX8 3 V 200 ns MASK ROM 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 10 µA 20 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e0 85 °C -40 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.9972 mm 20.447 mm 11.303 mm MACRONIX INTERNATIONAL CO LTD SOP, SOP32,.56 unknown EAR99 8542.32.00.71 SOIC 32
5962-01-028-6970
 Texas Instruments 		Check for Price No Obsolete 8 32X8 5 V 45 ns MASK ROM 32 32 words 80 µA TTL MILITARY R-XDIP-T16 Not Qualified 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL TEXAS INSTRUMENTS INC DIP, DIP16,.3 not_compliant EAR99 8542.32.00.71
LH53BV32900AN
 Sharp Corp 		Check for Price Obsolete 33.5544 Mbit 16 2MX16 3.3 V 100 ns MASK ROM CONFIGURABLE AS 1M X 32 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 30 µA 3.6 V 3 V CMOS R-PDSO-G70 Not Qualified 70 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 800 µm DUAL 3.1 mm 28.6 mm 12.7 mm SHARP CORP SSOP-70 unknown
UPD23C32380F9-XXX-BC3-A
 NEC Electronics America Inc 		Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 100 ns MASK ROM 8 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 50 µA CMOS COMMERCIAL R-PBGA-B48 Not Qualified e1 70 °C -10 °C 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.07 mm 8 mm 6 mm NEC ELECTRONICS AMERICA INC 8 X 6 MM, LED FREE, TFBGA-48 compliant
MX23L6451MC
 Macronix International Co Ltd 		Check for Price Obsolete MACRONIX INTERNATIONAL CO LTD , unknown EAR99 8542.32.00.71
KM23C512G-20
 Samsung Semiconductor 		Check for Price No Obsolete 524.288 kbit 8 64KX8 5 V 200 ns MASK ROM 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3 mm 20.47 mm 11.43 mm SAMSUNG SEMICONDUCTOR INC SOP, SOP32,.56 unknown EAR99 8542.32.00.71 SOIC 32
KM23256SJ-20
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 200 ns MASK ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 75 µA MOS COMMERCIAL S-PQCC-J28 Not Qualified e0 3 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD SAMSUNG SEMICONDUCTOR INC QCCJ, LDCC28,.5SQ unknown EAR99 8542.32.00.71
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