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S25FL256SAGNFI003
Infineon Technologies AG
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$4.7677 | Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | HVSON, SOLCC8,.3 | 8 | compliant | 3A991.B.1.A | 8542.32.00.51 | Infineon | |||
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S25FL256SAGNFI003
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | SPANSION INC | HVSON, SOLCC8,.3 | 8 | unknown | 3A991.B.1.A | 8542.32.00.51 | Spansion | SON | |||||||
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S25FL256SAGNFI003
Cypress Semiconductor
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$6.0183 | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | HVSON, SOLCC8,.3 | compliant | 3A991.B.1.A | 8542.32.00.51 |