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S29GL128P10TFI010
Spansion
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$3.1590 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL512P11TFI010
Spansion
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$4.6435 | Yes | Yes | Transferred | 536.8709 Mbit | 1 | 128K | 512MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 512 | 512000000 | 536.8709 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL256P10TFI010
Spansion
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$6.9156 | Yes | Yes | Transferred | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | ||||||||||
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S70FL01GSAGBHIC10
Spansion
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$9.0300 | Transferred | 1.0737 Gbit | 8 | 128MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 200 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | BGA-24 | unknown | 3A991.B.1.A | 8542.32.00.71 | |||||||||||||||||||||||||||
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S29GL01GP11TFIR10
Spansion
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$9.1523 | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL01GP12TFI010
Spansion
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$22.8786 | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 120 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL01GP11FFIR10
Spansion
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$24.2760 | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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AM29F800BT-70EI
Spansion
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$80.1324 | No | No | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 5 V | 70 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | YES | 1 mA | 60 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSOP1 | MO-142DD, TSOP-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||||||||||||
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S29CD016J1JQAI12
Spansion
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Check for Price | No | Transferred | 16.7772 Mbit | 32 | 2K,16K | 512KX32 | 2.6 V | 54 ns | 40 MHz | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 16,30 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 2.7 V | YES | 60 µA | 90 µA | 2.75 V | 2.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | 65 ns | R-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | YES | GULL WING | 800 µm | QUAD | 3.35 mm | 20 mm | 14 mm | SPANSION INC | QFP | QFP, QFP80,.7X.9,32 | 80 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S29CL032J0MQAM02
Spansion
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Check for Price | No | Transferred | 16.7772 Mbit | 32 | 512KX32 | 3.3 V | 54 ns | 56 MHz | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3.3 V | 3.6 V | 3 V | CMOS | AUTOMOTIVE | 65 ns | R-PQFP-G80 | Not Qualified | 125 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | GULL WING | 800 µm | QUAD | 3.35 mm | 20 mm | 14 mm | SPANSION INC | QFP | QFP, | 80 | unknown | EAR99 | 8542.32.00.51 |