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31 - 40 of 21,819 results
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M27C256B-60XF3X
STMicroelectronics
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Check for Price | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 60 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | AUTOMOTIVE | R-GDIP-T28 | Not Qualified | e3 | 125 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.97 mm | 36.92 mm | 15.24 mm | STMICROELECTRONICS | DIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | ||||||
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5962-8606305XX
Atmel Corporation
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ATMEL CORP | DIP | WDIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||
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M27C4001-15L6TR
STMicroelectronics
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Check for Price | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 100 ns | UVPROM | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.8 mm | 13.97 mm | 11.43 mm | STMICROELECTRONICS | QFJ | WINDOWED, CERAMIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.61 | |||||||
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AT27C800-15DC
Atmel Corporation
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 150 ns | UVPROM | CAN ALSO BE CONFIGURED AS 512K X 16 | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T42 | Not Qualified | e0 | 70 °C | 42 | CERAMIC, GLASS-SEALED | WDIP | DIP42,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 15.24 mm | ATMEL CORP | DIP | WDIP, DIP42,.6 | 42 | unknown | EAR99 | 8542.32.00.61 | ||||||||
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M27C801-80F1X
STMicroelectronics
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Check for Price | Yes | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 80 ns | UVPROM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T32 | Not Qualified | e3 | 70 °C | 32 | CERAMIC, GLASS-SEALED | WDIP | DIP32,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.97 mm | 41.885 mm | 15.24 mm | STMICROELECTRONICS | DIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | 32 | compliant | EAR99 | 8542.32.00.61 | ||||||||
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AM27256-25LI
AMD
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 5.5 V | 4.5 V | NMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.71 | ||||||
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27HC416L-55I/K
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 65.536 kbit | 16 | 4KX16 | 5 V | 55 ns | UVPROM | COMMON | 1 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 90 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-CQCC-N44 | Not Qualified | e0 | 85 °C | -40 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC44,.65SQ | SQUARE | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | MICROCHIP TECHNOLOGY INC | LCC | CERAMIC, LCC-44 | 44 | unknown | EAR99 | 8542.32.00.61 | |||||||||
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QP27C256-70/QYA
Teledyne e2v
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | TELEDYNE E2V (UK) LTD | DIP | HERMETIC SEALED, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | |||||||||||||||||
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AM27LV010-200DE
AMD
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 20 µA | 3.6 V | 3 V | CMOS | MILITARY | R-GDIP-T32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, GLASS-SEALED | WDIP | DIP32,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 42.1005 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP32,.6 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||
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AM27C1024-150LE
AMD
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Check for Price | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 150 ns | UVPROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQCC-N44 | Not Qualified | e0 | 125 °C | -55 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC44,.65SQ | SQUARE | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 16.51 mm | 16.51 mm | ADVANCED MICRO DEVICES INC | LCC | WQCCN, LCC44,.65SQ | 44 | unknown | 3A001.A.2.C | 8542.32.00.61 |