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AM27256-1DCB
AMD
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 5.25 V | 4.75 V | NMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.71 | |||||||||
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AM2764A-30/BUC
AMD
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 300 ns | OTP ROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 70 µA | 5.5 V | 4.5 V | NMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.71 | |||||||
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FM27C256Q70
Fairchild Semiconductor Corporation
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 200 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.3 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 36.83 mm | 15.24 mm | FAIRCHILD SEMICONDUCTOR CORP | DIP | WDIP, DIP28,.3 | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||||||
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AM27C64-155DIB
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||||||
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27C240-15IA
Philips Semiconductors
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 150 ns | UVPROM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 50 µA | CMOS | COMMERCIAL | R-XDIP-T40 | Not Qualified | e0 | 70 °C | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP40,.6 | unknown | EAR99 | 8542.32.00.61 | |||||||||||||||||
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AM27HB010-60LIB
AMD
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 60 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 1 mA | 100 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.61 | ||||||||
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M27W400-120XF6TR
STMicroelectronics
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Check for Price | Obsolete | 4.1943 Mbit | 16 | 256K16 | 120 ns | UVPROM | 8 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 20 µA | 3.78 V | 2.565 V | CMOS | INDUSTRIAL | R-GDIP-T40 | Not Qualified | 85 °C | -40 °C | 40 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.97 mm | 52.195 mm | 15.24 mm | STMICROELECTRONICS | DIP | WDIP, | 40 | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||
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AM27C080-150LIB
AMD
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 40 nA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.61 | |||||||||
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AM27C400-255DC
AMD
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 256K16 | 5 V | 250 ns | UVPROM | 8 | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 40 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-CDIP-T40 | Not Qualified | e0 | 70 °C | 40 | CERAMIC, METAL-SEALED COFIRED | WDIP | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 52.2605 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP40,.6 | 40 | unknown | EAR99 | 8542.32.00.61 | |||||||||
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DPV3232VA-90M
Twilight Technology Inc
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Check for Price | No | No | Active | 1.0486 Mbit | 16 | 64KX16 | 5 V | 90 ns | UVPROM MODULE | CONFIGURABLE AS 32K X 32 | 8 | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 180 mA | 360 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P66 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA66,11X11 | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 8.382 mm | 27.3 mm | 27.3 mm | TWILIGHT TECHNOLOGY INC | PGA | PGA-66 | 66 | unknown | 3A001.A.2.C | 8542.32.00.61 |