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Parametric » Memory » EPROMs

Parametric results for: m27c1024-80f6tr under EPROMs

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M27C256B-60XF3X
 STMicroelectronics 		Check for Price Yes Obsolete 262.144 kbit 8 32KX8 5 V 60 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.25 V 4.75 V CMOS AUTOMOTIVE R-GDIP-T28 Not Qualified e3 125 °C -40 °C 28 CERAMIC, GLASS-SEALED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.97 mm 36.92 mm 15.24 mm STMICROELECTRONICS DIP FRIT SEALED, WINDOWED, CERAMIC, DIP-28 28 compliant EAR99 8542.32.00.61
5962-8606305XX
 Atmel Corporation 		Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 150 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 300 µA 50 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 1 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC, GLASS-SEALED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.588 mm 37.1475 mm 15.24 mm ATMEL CORP DIP WDIP, DIP28,.6 28 unknown 3A001.A.2.C 8542.32.00.61
M27C4001-15L6TR
 STMicroelectronics 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 100 ns UVPROM COMMON 1 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CQCC-N32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER, WINDOW YES TIN LEAD NO LEAD 1.27 mm QUAD 2.8 mm 13.97 mm 11.43 mm STMICROELECTRONICS QFJ WINDOWED, CERAMIC, LCC-32 32 not_compliant EAR99 8542.32.00.61
AT27C800-15DC
 Atmel Corporation 		Check for Price No Obsolete 8.3886 Mbit 8 1MX8 5 V 150 ns UVPROM CAN ALSO BE CONFIGURED AS 512K X 16 COMMON 1 1000000 1.0486 M ASYNCHRONOUS 3-STATE PARALLEL 100 µA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-GDIP-T42 Not Qualified e0 70 °C 42 CERAMIC, GLASS-SEALED WDIP DIP42,.6 RECTANGULAR IN-LINE, WINDOW NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 5.72 mm 15.24 mm ATMEL CORP DIP WDIP, DIP42,.6 42 unknown EAR99 8542.32.00.61
M27C801-80F1X
 STMicroelectronics 		Check for Price Yes Obsolete 8.3886 Mbit 8 1MX8 5 V 80 ns UVPROM COMMON 1 1000000 1.0486 M ASYNCHRONOUS 3-STATE PARALLEL 100 µA 35 µA 5.5 V 4.5 V CMOS COMMERCIAL R-GDIP-T32 Not Qualified e3 70 °C 32 CERAMIC, GLASS-SEALED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.97 mm 41.885 mm 15.24 mm STMICROELECTRONICS DIP FRIT SEALED, WINDOWED, CERAMIC, DIP-32 32 compliant EAR99 8542.32.00.61
AM27256-25LI
 AMD 		Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 250 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 100 µA 5.5 V 4.5 V NMOS INDUSTRIAL R-CQCC-N32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC QFJ QCCN, LCC32,.45X.55 32 unknown EAR99 8542.32.00.71
27HC416L-55I/K
 Microchip Technology Inc 		Check for Price No No Obsolete 65.536 kbit 16 4KX16 5 V 55 ns UVPROM COMMON 1 4000 4.096 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 90 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-CQCC-N44 Not Qualified e0 85 °C -40 °C 44 CERAMIC, METAL-SEALED COFIRED WQCCN LCC44,.65SQ SQUARE CHIP CARRIER, WINDOW YES TIN LEAD NO LEAD 1.27 mm QUAD MICROCHIP TECHNOLOGY INC LCC CERAMIC, LCC-44 44 unknown EAR99 8542.32.00.61
QP27C256-70/QYA
 Teledyne e2v 		Check for Price Active 262.144 kbit 8 32KX8 5 V 70 ns UVPROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 25 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified 125 °C -55 °C MIL-STD-883 Class B 28 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL TELEDYNE E2V (UK) LTD DIP HERMETIC SEALED, CERAMIC, DIP-28 28 compliant 3A001.A.2.C 8542.32.00.61
AM27LV010-200DE
 AMD 		Check for Price No Obsolete 1.0486 Mbit 8 128KX8 3.3 V 200 ns UVPROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 25 µA 20 µA 3.6 V 3 V CMOS MILITARY R-GDIP-T32 Not Qualified e0 125 °C -55 °C 32 CERAMIC, GLASS-SEALED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1005 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP WDIP, DIP32,.6 32 unknown 3A001.A.2.C 8542.32.00.61
AM27C1024-150LE
 AMD 		Check for Price No Obsolete 1.0486 Mbit 16 64KX16 5 V 150 ns UVPROM COMMON 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 60 µA 5.5 V 4.5 V CMOS MILITARY S-CQCC-N44 Not Qualified e0 125 °C -55 °C 44 CERAMIC, METAL-SEALED COFIRED WQCCN LCC44,.65SQ SQUARE CHIP CARRIER, WINDOW YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 3.556 mm 16.51 mm 16.51 mm ADVANCED MICRO DEVICES INC LCC WQCCN, LCC44,.65SQ 44 unknown 3A001.A.2.C 8542.32.00.61
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