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71 - 80 of 21,819 results
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NMC27C128BQM200
Texas Instruments
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Check for Price | No | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.715 mm | 15.24 mm | NATIONAL SEMICONDUCTOR CORP | DIP | WDIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||
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WS27C128L-12TMB
Waferscale Integration Inc
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 120 ns | UVPROM CARD | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 50 µA | CMOS | MILITARY | R-XDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WAFERSCALE INTEGRATION INC | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||||
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C27011-250V10
Intel Corporation
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 150 µA | MOS | COMMERCIAL | R-XDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTEL CORP | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.61 | |||||||||||||||||
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CY27H512-30HC
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 524.288 kbit | 8 | 64KX8 | 5 V | 30 ns | UVPROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 75 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CQCC-J32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | CYPRESS SEMICONDUCTOR CORP | QFJ | WINDOWED, HERMETIC SEALED, CERAMIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.61 | |||||||||||
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AT27C256R-70KC
Atmel Corporation
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CQCC-J32 | Not Qualified | e0 | 2 | 70 °C | 225 | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.24 mm | 14.1 mm | 11.55 mm | ATMEL CORP | QFJ | WQCCJ, LDCC32,.5X.6 | 32 | unknown | EAR99 | 8542.32.00.61 | |||||
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AM27C256-155DIB
Rochester Electronics LLC
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T28 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ROCHESTER ELECTRONICS LLC | DIP, | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||
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AT27C010-55LI
Atmel Corporation
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | 1 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | NO LEAD | 1.27 mm | QUAD | 2.92 mm | 13.97 mm | 11.43 mm | ATMEL CORP | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.61 | ||||||||
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5962-8606315UA
Teledyne e2v
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 25 mA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | TELEDYNE E2V (UK) LTD | DIP | CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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5962-8764802YX
Atmel Corporation
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Check for Price | Transferred | 524.288 kbit | 8 | 64KX8 | 5 V | 200 ns | UVPROM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | RECTANGULAR | CHIP CARRIER, WINDOW | YES | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ATMEL CORP | QFJ | WQCCN, | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||||||
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AM27C4096-120DI
Spansion
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Check for Price | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 120 ns | UVPROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T40 | Not Qualified | 85 °C | -40 °C | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 52.26 mm | 15.24 mm | SPANSION INC | DIP | DIP, | 40 | unknown | EAR99 | 8542.32.00.61 |