Parametric results for: WV3HG64M64EEU under DRAMs

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IS42S16100H-6TL
Integrated Silicon Solution Inc
$0.9780 Yes Active 16.7772 Mbit 16 1MX16 3.3 V 5.5 ns 166 MHz 2048 DUAL BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 1000000 1.0486 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 2 mA 70 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G50 Not Qualified 70 °C 50 PLASTIC/EPOXY TSOP2 TSOP50,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 20.95 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP50,.46,32 compliant EAR99 8542.32.00.02 Integrated Silicon Solution Inc.
IS42S16400J-7B2LI
Integrated Silicon Solution Inc
$1.0000 Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 5.4 ns 143 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO YES 1,2,4,8,FP 70 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B60 Not Qualified 85 °C -40 °C 60 PLASTIC/EPOXY TFBGA BGA60,7X15,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1.2 mm 10.1 mm 6.4 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA60,7X15,25 compliant EAR99 8542.32.00.02 Integrated Silicon Solution Inc. BGA 60
IS46LQ32256A-062BLA2-TR
Integrated Silicon Solution Inc
$1.0000 Yes Active 8.5899 Gbit 32 256MX32 1.1 V 1.6 GHz 8192 MULTI BANK PAGE BURST LPDDR4 DRAM COMMON 16,32 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 16,32 200 µA 530 µA 1.17 V 1.06 V CMOS R-PBGA-B200 105 °C -40 °C 260 AEC-Q100 30 200 PLASTIC/EPOXY TFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.1 mm 14.5 mm 10 mm INTEGRATED SILICON SOLUTION INC compliant
IS42SM16200D-6BLI
Integrated Silicon Solution Inc
$1.0000 Yes Active 33.5544 Mbit 16 2MX16 3.3 V 5.5 ns DUAL BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS INDUSTRIAL S-PBGA-B54 e1 3 85 °C -40 °C 54 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 8 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant EAR99 8542.32.00.02 Integrated Silicon Solution Inc.
IS45S16100H-7BLA2-TR
Integrated Silicon Solution Inc
$1.0060 Yes Active 16.7772 Mbit 16 1MX16 3.3 V 5.5 ns DUAL BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 1000000 1.0486 M SYNCHRONOUS YES 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B60 105 °C -40 °C NOT SPECIFIED NOT SPECIFIED 60 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1.2 mm 10.1 mm 6.4 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant EAR99 8542.32.00.02 Integrated Silicon Solution Inc.
IS43LR16400C-6BLI-TR
Integrated Silicon Solution Inc
$1.0403 Yes Yes Active 67.1089 Mbit 16 4MX16 1.8 V 5.5 ns FOUR BANK PAGE BURST DDR1 DRAM AUTO/SELF REFRESH 1 1 4000000 4.1943 M SYNCHRONOUS YES 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B60 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 60 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.1 mm 10 mm 8 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant EAR99 8542.32.00.02
MT41K256M8DA-125:K
Micron Technology Inc
$1.0750 Yes Active 2.1475 Gbit 8 256MX8 1.35 V 225 ps 800 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH COMMON 8 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 8 12 mA 156 µA 1.45 V 1.283 V CMOS OTHER R-PBGA-B78 Not Qualified e1 3 95 °C 260 30 78 PLASTIC/EPOXY TFBGA BGA78,9X13,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 10.5 mm 8 mm MICRON TECHNOLOGY INC TFBGA, BGA78,9X13,32 not_compliant EAR99 8542.32.00.36 Micron BGA 78
MT41K128M16JT-107:K
Micron Technology Inc
$1.0750 Yes Active 2.1475 Gbit 16 128MX16 1.35 V 195 ps 933 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY COMMON 8 1 1 128000000 134.2177 M SYNCHRONOUS 3-STATE YES 8 12 mA 219 µA 1.45 V 1.283 V CMOS OTHER R-PBGA-B96 Not Qualified e1 85 °C 96 PLASTIC/EPOXY TFBGA BGA96,9X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm MICRON TECHNOLOGY INC compliant EAR99 8542.32.00.36 Micron
IS42S16100H-7BLI
Integrated Silicon Solution Inc
$1.1228 Yes Active 16.7772 Mbit 16 1MX16 3.3 V 5.5 ns 143 MHz 2048 DUAL BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 1000000 1.0486 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 3.5 mA 70 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B60 Not Qualified 85 °C -40 °C 60 PLASTIC/EPOXY TFBGA BGA60,7X15,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1.2 mm 10.1 mm 6.4 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA60,7X15,25 compliant EAR99 8542.32.00.02 Integrated Silicon Solution Inc.
MT41K256M8DA-107:K
Micron Technology Inc
$1.1645 Yes Active 2.1475 Gbit 8 256MX8 1.35 V 195 ps 933 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY COMMON 8 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 8 12 mA 164 µA 1.45 V 1.283 V CMOS OTHER R-PBGA-B78 Not Qualified e1 3 85 °C 260 30 78 PLASTIC/EPOXY TFBGA BGA78,9X13,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 10.5 mm 8 mm MICRON TECHNOLOGY INC TFBGA, BGA78,9X13,32 not_compliant EAR99 8542.32.00.36 Micron