Filter Your Search
1 - 10 of 70,172 results
|
SSTUB32865ET/G
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 1.8 V | 1.5 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | OPEN-DRAIN | 32865 | D FLIP-FLOP | CMOS | 450 MHz | COMPLEMENTARY | 2 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | 2 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | BGA160,12X18,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | 1.15 mm | 9 mm | 13 mm | NXP SEMICONDUCTORS | BGA | TFBGA, BGA160,12X18,25 | 160 | SOT-802-2 | unknown | 8542.39.00.01 | |||||||||||
|
ICSSSTUAF32868AHLFT
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 1.8 V | 3 ns | 1 | 28 | YES | LFBGA | POSITIVE EDGE | 32868 | D FLIP-FLOP | 410 MHz | TRUE | 1.9 V | 1.7 V | COMMERCIAL | R-PBGA-B176 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 176 | PLASTIC/EPOXY | BGA176,8X22,25 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 650 µm | BOTTOM | 1.55 mm | 6 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LFBGA, BGA176,8X22,25 | 176 | compliant | 8542.39.00.01 | |||||||||||
|
ICSSSTUA32S865AH-T
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 1.8 V | 1.9 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | OPEN-DRAIN | SSTU | D FLIP-FLOP | CMOS | 410 MHz | TRUE | 1.9 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | e0 | 70 °C | 160 | PLASTIC/EPOXY | BGA160,12X18,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 650 µm | BOTTOM | 1.2 mm | 9 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA160,12X18,25 | 160 | not_compliant | 8542.39.00.01 | ||||||||||||
|
SSTUM32865ET/G,518
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 1.8 V | 1.4 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | OPEN-DRAIN | SSTU | D FLIP-FLOP | 450 MHz | TRUE | 2 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | 2 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | 1.15 mm | 9 mm | 13 mm | NXP SEMICONDUCTORS | BGA | TFBGA, | 160 | SOT802-2 | unknown | 8542.39.00.01 | |||||||||||||
|
ICSSSTUB32872AHMT
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 1.8 V | 3 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | 32872 | D FLIP-FLOP | 410 MHz | TRUE | 1.9 V | 1.7 V | COMMERCIAL | R-PBGA-B96 | Not Qualified | e0 | 70 °C | 96 | PLASTIC/EPOXY | BGA96,6X16,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 650 µm | BOTTOM | 1.2 mm | 5 mm | 11.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA96,6X16,25 | 96 | compliant | 8542.39.00.01 | ||||||||||||||
|
SSTUA32S865ET/G
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 1.8 V | 1.8 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | OPEN-DRAIN | SSTU | D FLIP-FLOP | CMOS | 450 MHz | TRUE | 2 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | 2 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | BGA160,12X18,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | 1.2 mm | 9 mm | 13 mm | NXP SEMICONDUCTORS | BGA | TFBGA, BGA160,12X18,25 | 160 | SOT-802-1 | unknown | 8542.39.00.01 | |||||||||||
|
SSTUB32872AHMLFT
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 1.8 V | 3 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | 32872 | D FLIP-FLOP | 410 MHz | TRUE | 1.9 V | 1.7 V | COMMERCIAL | R-PBGA-B96 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 96 | PLASTIC/EPOXY | BGA96,6X16,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 650 µm | BOTTOM | 1.2 mm | 5 mm | 11.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | TFBGA, BGA96,6X16,25 | 96 | AFG96 | compliant | 8542.39.00.01 | ||||||||||
|
SSTUG32865ET/G,518
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 1.8 V | 1.4 ns | 1 | 28 | YES | TFBGA | POSITIVE EDGE | OPEN-DRAIN | SSTU | D FLIP-FLOP | 550 MHz | TRUE | 2 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | 2 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | 1.15 mm | 9 mm | 13 mm | NXP SEMICONDUCTORS | BGA | TFBGA, | 160 | SOT802-2 | unknown | 8542.39.00.01 | |||||||||||||
|
74SSTUB32865AZJBR
Texas Instruments
|
$11.8122 | Yes | Obsolete | 1.8 V | 3 ns | 1.1 ns | 1 | 28 | YES | TFBGA | 410 MHz | POSITIVE EDGE | OPEN-DRAIN | SSTU | D FLIP-FLOP | TTL | 410 MHz | 12 mA | TRUE | 1.9 V | 1.7 V | INDUSTRIAL | R-PBGA-B160 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 160 | PLASTIC/EPOXY | BGA160,12X18,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | TR | TIN SILVER COPPER | BALL | 650 µm | BOTTOM | 1.2 mm | 9 mm | 13 mm | TEXAS INSTRUMENTS INC | BGA | PLASTIC, TFBGA-160 | 160 | compliant | 8542.39.00.01 | Texas Instruments | ||||
|
IDT74SSTU32865BKG
Integrated Device Technology Inc
|
Check for Price | Yes | Obsolete | 1.8 V | 2.15 ns | 1 | 28 | YES | LFBGA | POSITIVE EDGE | SSTU | D FLIP-FLOP | TTL | 270 MHz | TRUE | 1.9 V | 1.7 V | COMMERCIAL | R-PBGA-B160 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 160 | PLASTIC/EPOXY | BGA160,12X18,25 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 650 µm | BOTTOM | 1.3 mm | 9 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | GREEN, CTBGA-160 | 160 | unknown | 8542.39.00.01 |