Parametric results for: adv7127jr240 under Digital to Analog Converters

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MCP47FEB02A0-E/ST
Microchip Technology Inc
$0.8592 Yes Active 5 V 5.46 V 10 mV 0.1953 % 8 YES D/A CONVERTER BINARY SERIAL 1 6 µs 700 µA AUTOMOTIVE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.2 mm 4.4 mm MICROCHIP TECHNOLOGY INC TSSOP, TSSOP8,.25 compliant EAR99 8542.39.00.01 Microchip
DAC43401DSGT
Texas Instruments
$0.8771 Yes Yes Active 2.7 V 5.5 V 0.3906 % 8 22 kHz YES D/A CONVERTER BINARY SERIAL 1 10 µs 10 µs AUTOMOTIVE S-PDSO-N8 e4 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY SON SQUARE SMALL OUTLINE NICKEL PALLADIUM GOLD NO LEAD DUAL TEXAS INSTRUMENTS INC SON, compliant EAR99 8542.39.00.01 Texas Instruments 2019-07-26
MCP48CVD01T-E/MG
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PQCC-N16 e3 125 °C -40 °C 16 PLASTIC/EPOXY HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 3 mm 900 µm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/MF
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PDSO-N10 e3 125 °C -40 °C 10 PLASTIC/EPOXY HVSON SOLCC10,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm DUAL 3 mm 1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/MG
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PQCC-N16 e3 125 °C -40 °C 16 PLASTIC/EPOXY HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 3 mm 900 µm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP48CVD01T-E/UN
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PDSO-G10 e3 125 °C -40 °C 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 500 µm DUAL 3 mm 1.1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/UN
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PDSO-G10 e3 125 °C -40 °C 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 500 µm DUAL 3 mm 1.1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP48CVD01T-E/MF
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PDSO-N10 e3 125 °C -40 °C 10 PLASTIC/EPOXY HVSON SOLCC10,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm DUAL 3 mm 1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47FVB01A3-E/ST
Microchip Technology Inc
$0.8910 Yes Active 5.5 V 5.46 V 10 mV 0.1953 % 8 YES D/A CONVERTER BINARY SERIAL 1 6 µs 500 µA AUTOMOTIVE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.2 mm 4.4 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant 8542.39.00.01 Microchip
MCP47FVB01A2-E/ST
Microchip Technology Inc
$0.8910 Yes Active 5.5 V 5.46 V 10 mV 0.1953 % 8 YES D/A CONVERTER BINARY SERIAL 1 6 µs 500 µA AUTOMOTIVE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.2 mm 4.4 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant EAR99 8542.39.00.01 Microchip