Parametric results for: WM8532CGEFL/V under Digital to Analog Converters

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MCP47FEB02A0-E/ST
Microchip Technology Inc
$0.8592 Yes Active 5 V 5.46 V 10 mV 0.1953 % 8 YES D/A CONVERTER BINARY SERIAL 1 6 µs 700 µA AUTOMOTIVE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.2 mm 4.4 mm MICROCHIP TECHNOLOGY INC TSSOP, TSSOP8,.25 compliant EAR99 8542.39.00.01 Microchip
DAC43401DSGT
Texas Instruments
$0.8771 Yes Yes Active 2.7 V 5.5 V 0.3906 % 8 22 kHz YES D/A CONVERTER BINARY SERIAL 1 10 µs 10 µs AUTOMOTIVE S-PDSO-N8 e4 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY SON SQUARE SMALL OUTLINE NICKEL PALLADIUM GOLD NO LEAD DUAL TEXAS INSTRUMENTS INC SON, compliant EAR99 8542.39.00.01 Texas Instruments 2019-07-26
MCP48CVD01T-E/MG
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PQCC-N16 e3 125 °C -40 °C 16 PLASTIC/EPOXY HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 3 mm 900 µm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/MF
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PDSO-N10 e3 125 °C -40 °C 10 PLASTIC/EPOXY HVSON SOLCC10,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm DUAL 3 mm 1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/MG
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PQCC-N16 e3 125 °C -40 °C 16 PLASTIC/EPOXY HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 3 mm 900 µm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP48CVD01T-E/UN
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PDSO-G10 e3 125 °C -40 °C 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 500 µm DUAL 3 mm 1.1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47CVD01T-E/UN
Microchip Technology Inc
$0.8900 Active 5.5 V 0.0390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 550 µA S-PDSO-G10 e3 125 °C -40 °C 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 500 µm DUAL 3 mm 1.1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP48CVD01T-E/MF
Microchip Technology Inc
$0.8900 Active 5.5 V 0.000390625 % 8 YES D/A CONVERTER BINARY SERIAL 1 4 µs 1.27 mA S-PDSO-N10 e3 125 °C -40 °C 10 PLASTIC/EPOXY HVSON SOLCC10,.12,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm DUAL 3 mm 1 mm 3 mm MICROCHIP TECHNOLOGY INC compliant
MCP47DA1T-A0E/OT
Microchip Technology Inc
$0.8910 Yes Active 5.5 V 3.667 V 1.833 V 1.0938 % 6 YES D/A CONVERTER BINARY SERIAL 1 6 µs 200 µA AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 TS 16949 40 6 PLASTIC/EPOXY LSSOP TSOP6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH MATTE TIN GULL WING 950 µm DUAL 1.6 mm 1.45 mm 2.9 mm MICROCHIP TECHNOLOGY INC LSSOP, TSOP6,.11,37 compliant EAR99 8542.39.00.01 Microchip
MCP47FVB01A3T-E/ST
Microchip Technology Inc
$0.8910 Yes Active 5.5 V 5.46 V 10 mV 0.1953 % 8 YES D/A CONVERTER BINARY SERIAL 1 6 µs 500 µA AUTOMOTIVE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.2 mm 4.4 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant EAR99 8542.39.00.01 Microchip