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MC1206B223K101CT
SPC Multicomp
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$0.0034 | Yes | Active | 22 nF | 100 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 3.2 mm | 1.6 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC0805B474K250CT
SPC Multicomp
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$0.0034 | Yes | Active | 470 nF | 25 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PLASTIC, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 2 mm | 1.25 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC0402B104K250CT
SPC Multicomp
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$0.0034 | Yes | Active | 100 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC1206B473K500CT
SPC Multicomp
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$0.0034 | Yes | Active | 47 nF | 50 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 3.2 mm | 1.6 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MSASE105SB7473MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 47 nF | 16 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSASE105SB7223MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 22 nF | 16 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB7473MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 47 nF | 25 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSASE105SB7473KFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 47 nF | 16 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB5223MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 22 nF | 25 V | 20 % | 0402 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB7223MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 22 nF | 25 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 |