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MC0603B102J500CT
SPC Multicomp
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$0.0026 | Yes | Active | 1 nF | 50 V | 5 % | 0603 | X7R | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MC0402B104K100CT
SPC Multicomp
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$0.0027 | Yes | Active | 100 nF | 10 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MCSH18B101K500CT
SPC Multicomp
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$0.0028 | Yes | Active | 100 pF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MCB0603R104KCT
SPC Multicomp
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$0.0028 | Yes | Active | 100 nF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MC0603N100J500CT
SPC Multicomp
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$0.0031 | Yes | Active | 10 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MCU0805C222JCT
SPC Multicomp
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$0.0031 | Yes | Active | 2.2 nF | 50 V | 5 % | 0805 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | SMT | TR, PLASTIC, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | MULTICOMP PRO | CHIP | compliant | EAR99 | 8532.24.00.20 | Multicomp Pro | ||||
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MT15N2R0B500CT
Walsin Technology Corporation
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$0.0033 | Yes | Active | 2 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | ||||
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MC1206B152K500CT
SPC Multicomp
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$0.0033 | Yes | Active | 1.5 nF | 50 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 3.2 mm | 1.6 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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MCSH18B102K160CT
SPC Multicomp
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$0.0034 | Yes | Active | 1 nF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||
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VJ0603A220GXACW1BC
Vishay Intertechnologies
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$0.0034 | Yes | Active | 22 pF | 50 V | 2 % | 0603 | C0G | 2 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 870 µm | 1.6 mm | 800 µm | VISHAY INTERTECHNOLOGY INC | CHIP | compliant | EAR99 | 8532.24.00.20 | Vishay |