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MC1206B332K500CT
SPC Multicomp
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$0.0027 | Yes | Active | 3.3 nF | 50 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 3.2 mm | 1.6 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MCSH21B104K100CT
SPC Multicomp
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$0.0027 | Yes | Active | 100 nF | 10 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER/PLASTIC, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC0402B104K100CT
SPC Multicomp
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$0.0029 | Yes | Active | 100 nF | 10 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC0603N100J500CT
SPC Multicomp
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$0.0030 | Yes | Active | 10 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MC0805X225K6R3CT
SPC Multicomp
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$0.0030 | Yes | Active | 2.2 µF | 6.3 V | 10 % | 0805 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MCB0603R104KCT
SPC Multicomp
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$0.0031 | Yes | Active | 100 nF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MSAST105SB5473KFNA01
TAIYO YUDEN
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$0.0031 | Yes | Active | 47 nF | 25 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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VJ0402Y103KXXCW1BC
Vishay Intertechnologies
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$0.0032 | Yes | Active | 10 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 550 µm | 1 mm | 500 µm | VISHAY INTERTECHNOLOGY INC | CHIP | compliant | EAR99 | 8532.24.00.20 | Vishay | ||
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MC0402N101J500CT
SPC Multicomp
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$0.0032 | Yes | Active | 100 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||
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MCU0805C222JCT
SPC Multicomp
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$0.0032 | Yes | Active | 2.2 nF | 50 V | 5 % | 0805 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | SMT | TR, PLASTIC, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | MULTICOMP PRO | CHIP | compliant | EAR99 | 8532.24.00.20 | Multicomp Pro |