Parametric results for: Buffer Amplifiers

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HFA1113IB
Intersil Corporation
Check for Price No Obsolete 35 mV 850 MHz 1500 V/us 35 µA 33 mA 1 BUFFER 5 V -5 V BIPOLAR 35 µA -6 V 50 mA 800 V/us 6 V INDUSTRIAL R-PDSO-G8 Not Qualified e0 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL INTERSIL CORP SOIC SOIC-8 8 not_compliant EAR99 8542.33.00.01
HA4P5002-5
Harris Semiconductor
Check for Price No Transferred 30 mV 110 MHz 1300 V/us 10 µA 10 mA 1 BUFFER 15 V -15 V BIPOLAR 7 µA -22 V 1000 V/us 22 V COMMERCIAL EXTENDED S-PQCC-J20 Not Qualified e0 75 °C 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD HARRIS SEMICONDUCTOR unknown EAR99 8542.33.00.01
LTC6417CUDC#TRPBF
Linear Technology
Check for Price Yes Transferred 3.2 mV 1.6 GHz 10 V/us 145 mA 1 BUFFER 13 µA 100 mA 5.25 V COMMERCIAL R-PQCC-N20 e3 1 70 °C 260 30 20 PLASTIC/EPOXY HVQCCN LCC20,.12X.16,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR YES MATTE TIN NO LEAD 500 µm QUAD 800 µm 3 mm 4 mm LINEAR TECHNOLOGY CORP QFN QFN-20 20 compliant EAR99 8542.33.00.01 UDC
LM110J
Rochester Electronics LLC
Check for Price Active 6 mV 20 MHz 30 V/us 10 nA 1 BUFFER 15 V -15 V BIPOLAR -18 V 18 V MILITARY R-GDIP-T14 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 14 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.08 mm 7.62 mm 19.43 mm ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.33.00.01
CLC110AIB
National Semiconductor Corporation
Check for Price No Obsolete 16 mV 730 MHz 800 V/us 50 µA 20 mA 1 BUFFER 5 V -5 V BIPOLAR 50 µA -7 V 500 V/us 7 V INDUSTRIAL R-GDIP-T8 Not Qualified e0 85 °C -40 °C 8 CERAMIC, GLASS-SEALED DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP DIP DIP, DIP8,.3 8 unknown EAR99 8542.33.00.01
LT1010CDD#PBF
Linear Technology
$1.9350 Yes Transferred 20 MHz 800 µA 10 mA 1 BUFFER 15 V -15 V BIPOLAR 800 µA -22 V 75 V/us 22 V OTHER S-PDSO-N8 Not Qualified e3 1 125 °C 260 30 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 500 µm DUAL 800 µm 3 mm 3 mm LINEAR TECHNOLOGY CORP DFN 3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8 8 compliant EAR99 8542.33.00.01 DD
AM310N
AMD
Check for Price Obsolete 10 mV 20 MHz 30 V/us 10 nA 1 BUFFER -18 V 18 V COMMERCIAL R-PDIP-T8 Not Qualified 70 °C 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.08 mm 7.62 mm 9.779 mm ADVANCED MICRO DEVICES INC DIP DIP, 8 unknown EAR99 8542.33.00.01
LH0002CH
Alpha Semiconductor
Check for Price No Transferred 30 mV 10 mA 1 BUFFER 12 V -12 V HYBRID 10 µA INDUSTRIAL O-MBCY-W8 Not Qualified e0 85 °C -40 °C 8 METAL CAN8,.2 ROUND CYLINDRICAL Tin/Lead (Sn/Pb) WIRE BOTTOM ALPHA SEMICONDUCTOR unknown EAR99 8542.33.00.01
LM6221H
National Semiconductor Corporation
Check for Price No Obsolete 60 mV 50 MHz 1200 V/us 7 µA 20 mA 1 BUFFER 15 V -15 V BIPOLAR 7 µA -18 V 550 V/us 18 V INDUSTRIAL O-MBCY-W8 Not Qualified e0 85 °C -40 °C 8 METAL CAN8,.2 ROUND CYLINDRICAL NO TIN LEAD WIRE BOTTOM NATIONAL SEMICONDUCTOR CORP BCY , CAN8,.2 8 unknown EAR99 8542.33.00.01
LH0033ACG
Maxim Integrated Products
Check for Price No Obsolete 20 mV 100 MHz 1400 V/us 10 nA 24 mA 1 BUFFER 15 V -15 V BIPOLAR 2.5 nA -20 V 1000 V/us 20 V OTHER O-MBCY-W12 Not Qualified e0 85 °C -25 °C 12 METAL TO-8 QUAD12,.4SQ ROUND CYLINDRICAL NO TIN LEAD WIRE 2.54 mm BOTTOM MAXIM INTEGRATED PRODUCTS INC TO-8 TO-8, 12 PIN 12 not_compliant EAR99 8542.33.00.01