Datasheets
ZXMP10A16KTC by:
Zetex / Diodes Inc
Diodes Incorporated
Zetex / Diodes Inc
Not Found

Power Field-Effect Transistor, 4.6A I(D), 100V, 0.285ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, DPAK, 4 PIN

Part Details for ZXMP10A16KTC by Zetex / Diodes Inc

Results Overview of ZXMP10A16KTC by Zetex / Diodes Inc

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Applications Consumer Electronics Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

ZXMP10A16KTC Information

ZXMP10A16KTC by Zetex / Diodes Inc is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for ZXMP10A16KTC

Part # Distributor Description Stock Price Buy
Bristol Electronics   Min Qty: 4 40
  • 4 $1.5000
  • 15 $0.9750
$0.9750 / $1.5000 Buy Now
Quest Components POWER FIELD-EFFECT TRANSISTOR, 4.6A I(D), 100V, 0.285OHM, 1-ELEMENT, P-CHANNEL, SILICON, METAL-OXIDE... SEMICONDUCTOR FET more 32
  • 1 $2.0000
  • 4 $1.6000
  • 14 $1.0000
$1.0000 / $2.0000 Buy Now

Part Details for ZXMP10A16KTC

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ZXMP10A16KTC Part Data Attributes

ZXMP10A16KTC Zetex / Diodes Inc
Buy Now Datasheet
Compare Parts:
ZXMP10A16KTC Zetex / Diodes Inc Power Field-Effect Transistor, 4.6A I(D), 100V, 0.285ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, DPAK, 4 PIN
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer ZETEX PLC
Package Description DPAK, 4 PIN
Reach Compliance Code not_compliant
ECCN Code EAR99
Additional Feature FAST SWITCHING, LOW THRESHOLD
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 4.6 A
Drain-source On Resistance-Max 0.285 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-G4
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 4
Operating Mode ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type P-CHANNEL
Pulsed Drain Current-Max (IDM) 15.4 A
Qualification Status Not Qualified
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Transistor Application SWITCHING
Transistor Element Material SILICON

ZXMP10A16KTC Related Parts

ZXMP10A16KTC Frequently Asked Questions (FAQ)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-ounce copper layer and to avoid routing high-current traces under the device.

  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid overheating the device.

  • The ZXMP10A16KTC has built-in ESD protection, but it's still important to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap, working on an ESD mat, and storing the devices in anti-static packaging. It's also recommended to avoid touching the device's pins or handling it by the leads.

  • The ZXMP10A16KTC is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper design, testing, and validation. However, it's essential to consult with the manufacturer and ensure that the device meets the specific requirements and standards of the application.

  • To troubleshoot common issues like overheating or low output voltage, start by checking the PCB layout and thermal design. Ensure that the device is properly soldered and that there are no signs of damage or contamination. Next, verify that the input voltage and current are within the recommended operating conditions. Use a thermal camera or temperature probe to check the device temperature, and an oscilloscope to monitor the output voltage and current.