Part Details for ZSC31014EIC by Integrated Device Technology Inc
Overview of ZSC31014EIC by Integrated Device Technology Inc
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- Part Data Attributes: (Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for ZSC31014EIC
ZSC31014EIC CAD Models
ZSC31014EIC Part Data Attributes
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ZSC31014EIC
Integrated Device Technology Inc
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Datasheet
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ZSC31014EIC
Integrated Device Technology Inc
WAFER-0, Wafer
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | WAFER | |
Package Description | DIE | |
Pin Count | 0 | |
Manufacturer Package Code | DICEF | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | X-XUUC-N | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Position | UNSPECIFIED |