Part Details for ZL50111GAG2 by Zarlink Semiconductor Inc
Overview of ZL50111GAG2 by Zarlink Semiconductor Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Communication and Networking
Price & Stock for ZL50111GAG2
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 1 | 4 |
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$275.3800 | Buy Now |
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Bristol Electronics | Min Qty: 1 | 3 |
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$275.3800 | Buy Now |
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Quest Components | TELECOM CIRCUIT, 1-FUNC, PBGA552 | 5 |
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$343.0000 / $367.5000 | Buy Now |
Part Details for ZL50111GAG2
ZL50111GAG2 CAD Models
ZL50111GAG2 Part Data Attributes
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ZL50111GAG2
Zarlink Semiconductor Inc
Buy Now
Datasheet
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Compare Parts:
ZL50111GAG2
Zarlink Semiconductor Inc
Telecom Circuit, 1-Func, PBGA552, 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
Package Description | 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B552 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Number of Functions | 1 | |
Number of Terminals | 552 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA552,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.53 mm | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm |