Part Details for ZL50110GAG by Zarlink Semiconductor Inc
Overview of ZL50110GAG by Zarlink Semiconductor Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Energy and Power Systems
Healthcare
Telecommunications
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Part Details for ZL50110GAG
ZL50110GAG CAD Models
ZL50110GAG Part Data Attributes:
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ZL50110GAG
Zarlink Semiconductor Inc
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ZL50110GAG
Zarlink Semiconductor Inc
Telecom Circuit, 1-Func, PBGA552, 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034BAR-2, BGA-552
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
| Package Description | 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034BAR-2, BGA-552 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B552 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 552 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA552,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.53 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |