Datasheets
ZL30142GGG2 by:
Microchip Technology Inc
Microchip Technology Inc
Microsemi Corporation
Zarlink Semiconductor Inc
Not Found

ATM/SONET/SDH Support Circuit, 1-Func, PBGA64

Part Details for ZL30142GGG2 by Microchip Technology Inc

Results Overview of ZL30142GGG2 by Microchip Technology Inc

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ZL30142GGG2 Information

ZL30142GGG2 by Microchip Technology Inc is an ATM/SONET/SDH IC.
ATM/SONET/SDH ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for ZL30142GGG2

Part # Distributor Description Stock Price Buy
DISTI # ZL30142GGG2-ND
DigiKey IC SONET/SDH SYNCH 64CABGA Min Qty: 1 Lead time: 9 Weeks Container: Tray 86
In Stock
  • 1 $40.6800
  • 10 $30.2620
  • 25 $28.4248
$28.4248 / $40.6800 Buy Now
DISTI # 494-ZL30142GGG2
Mouser Electronics Clock Generators & Support Products Pb Free Stratum 3 Network RoHS: Compliant 0
  • 260 $37.5200
$37.5200 Order Now
DISTI # ZL30142GGG2
Microchip Technology Inc Pb Free Stratum 3 Network, LBGA, Projected EOL: 2044-04-25 RoHS: Compliant Lead time: 9 Weeks, 0 Days Container: Tray 0

Alternates Available
Buy Now
Bristol Electronics   201
RFQ
Quest Components   160
  • 1 $78.2160
  • 31 $62.5728
  • 81 $60.6174
$60.6174 / $78.2160 Buy Now

Part Details for ZL30142GGG2

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ZL30142GGG2 Part Data Attributes

ZL30142GGG2 Microchip Technology Inc
Buy Now Datasheet
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ZL30142GGG2 Microchip Technology Inc ATM/SONET/SDH Support Circuit, 1-Func, PBGA64
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant
Factory Lead Time 8 Weeks
Samacsys Manufacturer Microchip
Applications SDH; SONET
JESD-30 Code S-PBGA-B64
JESD-609 Code e1
Length 9 mm
Number of Functions 1
Number of Terminals 64
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA64,8X8,40
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.72 mm
Supply Current-Max 159 mA
Supply Voltage-Nom 1.8 V
Surface Mount YES
Telecom IC Type ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 9 mm

ZL30142GGG2 Related Parts

ZL30142GGG2 Frequently Asked Questions (FAQ)

  • Microchip provides a recommended PCB layout in the device's evaluation board documentation, which includes guidelines for component placement, routing, and thermal management.

  • Microchip offers application notes and design guides that provide guidance on optimizing the device's performance in various applications, including clocking, power management, and signal integrity.

  • The device has a maximum junction temperature of 150°C, and thermal management is critical to ensure reliable operation. Microchip recommends using thermal vias, heat sinks, and thermal interface materials to manage heat dissipation.

  • The ZL30142GGG2 is not specifically designed for radiation-hardened or high-reliability applications. However, Microchip offers other devices that are designed for these types of applications, such as the RH1080 and RH3020.

  • The device is designed to meet EMI and RFI standards, but proper PCB layout, shielding, and filtering are still necessary to ensure compliance. Microchip recommends following best practices for EMI and RFI mitigation in the device's application notes.