Datasheets
Z0103NN by:
NXP Semiconductors
Honest Han
NXP Semiconductors
Philips Semiconductors
STMicroelectronics
WeEn Semiconductor Co Ltd
Weida Semiconductor Inc
Not Found

800V, 1A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-73, 4 PIN

Part Details for Z0103NN by NXP Semiconductors

Results Overview of Z0103NN by NXP Semiconductors

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Z0103NN Information

Z0103NN by NXP Semiconductors is a TRIAC.
TRIACs are under the broader part category of Trigger Devices.

Trigger devices initiate or control actions in electronic circuits by producing output signals when specific input conditions are met. They are commonly used in timing circuits and pulse generators. Read more about Trigger Devices on our Trigger Devices part category page.

Price & Stock for Z0103NN

Part # Distributor Description Stock Price Buy
Ameya Holding Limited   3942
RFQ
Chip-Germany GmbH   RoHS: Not Compliant 3942
RFQ

Part Details for Z0103NN

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Z0103NN Part Data Attributes

Z0103NN NXP Semiconductors
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Z0103NN NXP Semiconductors 800V, 1A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-73, 4 PIN
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SC-73
Package Description PLASTIC, SC-73, 4 PIN
Pin Count 4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.30.00.80
Additional Feature SENSITIVE GATE
Case Connection MAIN TERMINAL 2
Configuration SINGLE
DC Gate Trigger Current-Max 5 mA
DC Gate Trigger Voltage-Max 1.3 V
Holding Current-Max 7 mA
JESD-30 Code R-PDSO-G4
JESD-609 Code e3
Leakage Current-Max 0.5 mA
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 4
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RMS On-state Current-Max 1 A
Repetitive Peak Off-state Voltage 800 V
Surface Mount YES
Terminal Finish TIN
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Device Type 4 QUADRANT LOGIC LEVEL TRIAC

Alternate Parts for Z0103NN

This table gives cross-reference parts and alternative options found for Z0103NN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of Z0103NN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
Z0103NN,135 WeEn Semiconductor Co Ltd $0.2187 4 Quadrant Logic Level TRIAC, 800V V(DRM), 1A I(T)RMS, PLASTIC, SC-73, 4 PIN Z0103NN vs Z0103NN,135
Z0103NN Philips Semiconductors Check for Price TRIAC, 800V V(DRM), 1A I(T)RMS, Z0103NN vs Z0103NN

Z0103NN Related Parts

Z0103NN Frequently Asked Questions (FAQ)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).

  • The Z0103NN has an internal overcurrent protection feature that can be enabled by connecting the OCP pin to a resistor and capacitor network. The application note AN11542 provides a detailed example of how to implement overcurrent protection.

  • The Z0103NN is rated for operation from -40°C to 125°C, but the maximum operating temperature range may vary depending on the specific application and environmental conditions. It's recommended to consult the datasheet and application notes for more information.

  • NXP provides a troubleshooting guide in the application note AN11542, which includes steps to identify and resolve common issues such as overvoltage, undervoltage, and overcurrent conditions.

  • NXP provides guidelines for soldering and rework conditions in the application note AN11542, which includes recommended temperature profiles, soldering times, and rework techniques to ensure reliable assembly and minimize damage to the device.