Part Details for XRT86VL30IV80-F by MaxLinear Inc
Results Overview of XRT86VL30IV80-F by MaxLinear Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XRT86VL30IV80-F Information
XRT86VL30IV80-F by MaxLinear Inc is a Digital Transmission Controller.
Digital Transmission Controllers are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for XRT86VL30IV80-F
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
68484886
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Verical | Framer DS1/E1/J1/T1 1.8V/3.3V 80-Pin LQFP RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2301 | Americas - 3 |
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$16.9165 / $18.1700 | Buy Now |
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Flip Electronics | Stock, ship today | 4355 |
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RFQ |
Part Details for XRT86VL30IV80-F
XRT86VL30IV80-F CAD Models
XRT86VL30IV80-F Part Data Attributes
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XRT86VL30IV80-F
MaxLinear Inc
Buy Now
Datasheet
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Compare Parts:
XRT86VL30IV80-F
MaxLinear Inc
Framer, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, LQFP-80
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MAXLINEAR INC | |
Package Description | LQFP-80 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | MaxLinear, Inc. | |
JESD-30 Code | S-PQFP-G80 | |
JESD-609 Code | e3 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 80 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | FRAMER | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 12 mm |
Alternate Parts for XRT86VL30IV80-F
This table gives cross-reference parts and alternative options found for XRT86VL30IV80-F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XRT86VL30IV80-F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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BT8370KPF | Synaptics Incorporated | Check for Price | Framer, CMOS, PQFP80, METRIC, QFP-80 | XRT86VL30IV80-F vs BT8370KPF |
BT8375EPF | Rockwell Automation | Check for Price | Framer, PQFP80, | XRT86VL30IV80-F vs BT8375EPF |
RS8953SPBEPF | Mindspeed Technologies Inc | Check for Price | Framer, CMOS, PQFP80, PLASTIC, QFP-80 | XRT86VL30IV80-F vs RS8953SPBEPF |
MT9076BB | Microchip Technology Inc | Check for Price | Framer, PQFP80 | XRT86VL30IV80-F vs MT9076BB |
BT8375EPF | Mindspeed Technologies Inc | Check for Price | Framer, CMOS, PQFP80, MQFP-80 | XRT86VL30IV80-F vs BT8375EPF |
BT8376KPF | Rockwell Automation | Check for Price | Framer, PQFP80, | XRT86VL30IV80-F vs BT8376KPF |
T7230A--TL | Avago Technologies | Check for Price | DATACOM, FRAMER, PQFP80, TQFP-80 | XRT86VL30IV80-F vs T7230A--TL |
PEF20550 | Infineon Technologies AG | Check for Price | Time Slot Assigner, CMOS, PQFP80, METRIC, PLASTIC, QFP-80 | XRT86VL30IV80-F vs PEF20550 |
PEF2256H | Intel Corporation | Check for Price | Framer, PQFP80, PLASTIC, MQFP-80 | XRT86VL30IV80-F vs PEF2256H |
XRT86VL30IV80-F | Exar Corporation | Check for Price | Framer, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, LQFP-80 | XRT86VL30IV80-F vs XRT86VL30IV80-F |
XRT86VL30IV80-F Frequently Asked Questions (FAQ)
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The recommended PCB layout involves keeping the analog and digital sections separate, using a solid ground plane, and placing decoupling capacitors close to the device. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.
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To optimize power consumption, use the device's power-down modes, reduce the clock frequency, and adjust the voltage regulator settings. Additionally, consider using a low-dropout regulator (LDO) to minimize power loss.
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To mitigate EMI and RFI, use a multi-layer PCB, keep signal traces short and away from the device's analog inputs, and use shielding or filtering on sensitive signals. Also, ensure proper grounding and decoupling to reduce noise.
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To troubleshoot ADC issues, check the analog input signal quality, ensure proper ADC configuration and calibration, and verify the clock frequency and sampling rate. Also, check for noise and interference on the analog inputs.
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For high-reliability or safety-critical applications, consider using redundant systems, implementing error detection and correction mechanisms, and following relevant industry standards (e.g., IEC 61508). Also, ensure proper testing and validation of the design.