Datasheets
XRT86VL30IV80-F by:
MaxLinear Inc
Exar Corporation
MaxLinear Inc
Not Found

Framer, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, LQFP-80

Part Details for XRT86VL30IV80-F by MaxLinear Inc

Results Overview of XRT86VL30IV80-F by MaxLinear Inc

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

XRT86VL30IV80-F Information

XRT86VL30IV80-F by MaxLinear Inc is a Digital Transmission Controller.
Digital Transmission Controllers are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for XRT86VL30IV80-F

Part # Distributor Description Stock Price Buy
DISTI # 68484886
Verical Framer DS1/E1/J1/T1 1.8V/3.3V 80-Pin LQFP RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2301 Americas - 3
  • 1 $18.1700
  • 10 $17.2500
  • 25 $16.9165
$16.9165 / $18.1700 Buy Now
Flip Electronics Stock, ship today 4355
RFQ

Part Details for XRT86VL30IV80-F

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XRT86VL30IV80-F Part Data Attributes

XRT86VL30IV80-F MaxLinear Inc
Buy Now Datasheet
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XRT86VL30IV80-F MaxLinear Inc Framer, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, LQFP-80
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MAXLINEAR INC
Package Description LQFP-80
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer MaxLinear, Inc.
JESD-30 Code S-PQFP-G80
JESD-609 Code e3
Length 12 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 80
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Telecom IC Type FRAMER
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm

Alternate Parts for XRT86VL30IV80-F

This table gives cross-reference parts and alternative options found for XRT86VL30IV80-F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XRT86VL30IV80-F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BT8370KPF Synaptics Incorporated Check for Price Framer, CMOS, PQFP80, METRIC, QFP-80 XRT86VL30IV80-F vs BT8370KPF
BT8375EPF Rockwell Automation Check for Price Framer, PQFP80, XRT86VL30IV80-F vs BT8375EPF
RS8953SPBEPF Mindspeed Technologies Inc Check for Price Framer, CMOS, PQFP80, PLASTIC, QFP-80 XRT86VL30IV80-F vs RS8953SPBEPF
MT9076BB Microchip Technology Inc Check for Price Framer, PQFP80 XRT86VL30IV80-F vs MT9076BB
BT8375EPF Mindspeed Technologies Inc Check for Price Framer, CMOS, PQFP80, MQFP-80 XRT86VL30IV80-F vs BT8375EPF
BT8376KPF Rockwell Automation Check for Price Framer, PQFP80, XRT86VL30IV80-F vs BT8376KPF
T7230A--TL Avago Technologies Check for Price DATACOM, FRAMER, PQFP80, TQFP-80 XRT86VL30IV80-F vs T7230A--TL
PEF20550 Infineon Technologies AG Check for Price Time Slot Assigner, CMOS, PQFP80, METRIC, PLASTIC, QFP-80 XRT86VL30IV80-F vs PEF20550
PEF2256H Intel Corporation Check for Price Framer, PQFP80, PLASTIC, MQFP-80 XRT86VL30IV80-F vs PEF2256H
XRT86VL30IV80-F Exar Corporation Check for Price Framer, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, LQFP-80 XRT86VL30IV80-F vs XRT86VL30IV80-F

XRT86VL30IV80-F Related Parts

XRT86VL30IV80-F Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves keeping the analog and digital sections separate, using a solid ground plane, and placing decoupling capacitors close to the device. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.

  • To optimize power consumption, use the device's power-down modes, reduce the clock frequency, and adjust the voltage regulator settings. Additionally, consider using a low-dropout regulator (LDO) to minimize power loss.

  • To mitigate EMI and RFI, use a multi-layer PCB, keep signal traces short and away from the device's analog inputs, and use shielding or filtering on sensitive signals. Also, ensure proper grounding and decoupling to reduce noise.

  • To troubleshoot ADC issues, check the analog input signal quality, ensure proper ADC configuration and calibration, and verify the clock frequency and sampling rate. Also, check for noise and interference on the analog inputs.

  • For high-reliability or safety-critical applications, consider using redundant systems, implementing error detection and correction mechanisms, and following relevant industry standards (e.g., IEC 61508). Also, ensure proper testing and validation of the design.