Part Details for XPC860TZP66D4 by Freescale Semiconductor
Overview of XPC860TZP66D4 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860TZP66D4
XPC860TZP66D4 CAD Models
XPC860TZP66D4 Part Data Attributes:
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XPC860TZP66D4
Freescale Semiconductor
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Datasheet
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XPC860TZP66D4
Freescale Semiconductor
IC,COMMUNICATIONS CONTROLLER,BGA,357PIN
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-357 | |
| Pin Count | 357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 5A991 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860TZP66D4
This table gives cross-reference parts and alternative options found for XPC860TZP66D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860TZP66D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC860TZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860TZP66D4 vs XPC860TZP66D4 |
| XPC860PCZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860TZP66D4 vs XPC860PCZP66D4 |
| XPC860DTCZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860TZP66D4 vs XPC860DTCZP66D4 |
| XPC860DPCZP66D3 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | XPC860TZP66D4 vs XPC860DPCZP66D3 |
| TSPC860SRMZP66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TZP66D4 vs TSPC860SRMZP66D |
| TSXPC860SRMZPU66C1 | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TZP66D4 vs TSXPC860SRMZPU66C1 |
| TSXPC860SRMZP66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TZP66D4 vs TSXPC860SRMZP66D |
| XPC860TZP66D3 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | XPC860TZP66D4 vs XPC860TZP66D3 |
| XPC860ENZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TZP66D4 vs XPC860ENZP66D4 |
| TSPC860SRVZPU66D4 | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TZP66D4 vs TSPC860SRVZPU66D4 |