Part Details for XPC860TCZP50D3 by Motorola Semiconductor Products
Overview of XPC860TCZP50D3 by Motorola Semiconductor Products
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860TCZP50D3
XPC860TCZP50D3 CAD Models
XPC860TCZP50D3 Part Data Attributes
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XPC860TCZP50D3
Motorola Semiconductor Products
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Datasheet
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XPC860TCZP50D3
Motorola Semiconductor Products
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA INC | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Number of Terminals | 357 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |
Alternate Parts for XPC860TCZP50D3
This table gives cross-reference parts and alternative options found for XPC860TCZP50D3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860TCZP50D3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860DEZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs MPC860DEZQ50D4 |
| TSPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TCZP50D3 vs TSPC860MHVZPU50B |
| XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs XPC860PZP50D3 |
| MPC855TZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | XPC860TCZP50D3 vs MPC855TZQ50D4 |
| XPC860ENCZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs XPC860ENCZP50D3 |
| XPC860DECZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860TCZP50D3 vs XPC860DECZP50D3 |
| XPC860PCZP50D3 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | XPC860TCZP50D3 vs XPC860PCZP50D3 |
| XPC860DECZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs XPC860DECZP50D4 |
| XPC860DPCZP50D3 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860TCZP50D3 vs XPC860DPCZP50D3 |
| TSPC860SRVZPU50D4 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TCZP50D3 vs TSPC860SRVZPU50D4 |