Part Details for XPC860ENZP66D4 by Motorola Mobility LLC
Overview of XPC860ENZP66D4 by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for XPC860ENZP66D4
XPC860ENZP66D4 CAD Models
XPC860ENZP66D4 Part Data Attributes
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XPC860ENZP66D4
Motorola Mobility LLC
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Datasheet
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XPC860ENZP66D4
Motorola Mobility LLC
32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MOTOROLA INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA357,19X19,50 | |
Pin Count | 357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 66 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 357 | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.05 mm | |
Speed | 66 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860ENZP66D4
This table gives cross-reference parts and alternative options found for XPC860ENZP66D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860ENZP66D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC860SRMZP66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ENZP66D4 vs TSPC860SRMZP66D |
TSPC860SRVZP66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ENZP66D4 vs TSPC860SRVZP66D |
TSPC860SRMZPU66D4 | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ENZP66D4 vs TSPC860SRMZPU66D4 |
XPC860ENCZP66D3 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860ENZP66D4 vs XPC860ENCZP66D3 |
TSPC860SRVZPU66D4 | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ENZP66D4 vs TSPC860SRVZPU66D4 |
XPC860DPCZP66D3 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860ENZP66D4 vs XPC860DPCZP66D3 |
TSXPC860SRVZPU66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Atmel Corporation | XPC860ENZP66D4 vs TSXPC860SRVZPU66D |
XPC860PZP66D4R2 | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860ENZP66D4 vs XPC860PZP66D4R2 |
XPC860DECZP66D3 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860ENZP66D4 vs XPC860DECZP66D3 |
XPC860SRCZP66D4 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | XPC860ENZP66D4 vs XPC860SRCZP66D4 |